LOCTITE ECCOBOND HYSOL UF3808 MSDS安全技术说明书

第一部分 化学品及企业标识 化学品中文名称:    LOCTITE ECCOBOND UF 3808 又名 Hysol UF3808 6OZ (-20DC) EN/CH 推荐用途:   环氧树脂 企业信息:    汉高(中国)投资有限公司 张衡路928号     201203     中国上海市浦东新区    中国 电话:+86-21-2891 8000 生效日期:   01.04.2016 应急信息:   应急电话:+86 532 8388 9090 (24小时)。   ...

作者:底部填充胶 | 分类:TDS&MSDS | 浏览:2,932 views

Underfill revisited: How a decades-old technique enables smaller, more durable PCBs

A well-orchestrated PCB design and assembly plan is required to successfully implement techniques such as underfill in next generation OEM embedded consumer and mobile designs. Two distinct market sectors in embedded systems are driving a trend to ever smaller components that do more, do it more reliably, and do it while withstandin...

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HENKEL HYSOL 3508NH Cornerfill TDS

PRODUCT DESCRIPTION 3508NH provides the following product characteristics: Technology Epoxy Appearance Black Cure Reflow Product Benefits ● One component ● Reflow curable ● Eliminates post-reflow dispenses and cure steps ● Reworkable ● Halogen free ● Improves mechanical reliability of hand-held devices Application Underfil...

作者:底部填充胶 | 分类:TDS&MSDS | 浏览:1,898 views

HENKEL LOCTITE 3128NH TDS

PRODUCT DESCRIPTION 3128NH provides the following product characteristics: Technology Epoxy Appearance Black viscous liquid Components One component - requires no mixing Product Benefits ● One component, requires no mixing ● Low temperature cure ● Low halogen content Cure Heat Cure Application Underfill Typical Assembly Appl...

作者:底部填充胶 | 分类:TDS&MSDS | 浏览:2,070 views

Electrolube ES501 Underfill Resin TDS

ES501 Underfill Resin ES 501 is an underfill resin designed to improve adhesive strength of devices during mechanical stress, whilst not degrading the thermal cycle performance. Its high flexibility provides enhanced repairability and is ideal for high volume assembly processes. • Fast, void-free underfill of area array devices; s...

作者:底部填充胶 | 分类:TDS&MSDS | 浏览:1,870 views

UNIQUE 3075BHF UNDERFILL MSDS

1. CHEMICAL PRODUCT AND COMPANY IDENTIFICATION 1) PRODUCT NAME : UNIQUE 3075BHF 2) CHEMICAL FAMILY : FORMULATED EPOXY RESIN 3) TYPICAL APPLICATIONS : UNDERFILL 3) MANUFACTURER : - NAME : HI-TECH KOREA CO., LTD. - ADDRESS : # 191-7, SUWORAM-RI, SEOTAN-MYEON, PYONGTAEK-SI, KYEONGGI-DO, KOREA - TELEPHONE NUMBER : +82-31-665-50...

作者:底部填充胶 | 分类:TDS&MSDS | 浏览:1,971 views

Hi-Tech Korea UNIQUE 3075BHF UNDERFILL TDS

1. PRODUCT DESCRIPTION UNIQUE 3075BHF is a fast flow, reworkable, single component epoxy glue that is designed to improve the attachment strength of CSP & BGA or Flip Chip devices during mechanical stress testing such as drop and bending testing. 2. KEY FEATURES * Excellent Chemical Resistance and Water-Proofing * Excellen...

作者:底部填充胶 | 分类:TDS&MSDS | 浏览:1,805 views

HENKEL LOCTITE 190967 UNDERFILL TDS EN

LOCTITE® 190967™is a single component, epoxy adhesive developed as reworkable CSP underfill. It cures rapidly at low temperature on exposure to heat. It is designed to give excellent protection of assembled devices from failure due to physical impact and/or thermal cycling. The low viscosity allows filling in gaps under CSP or BGA. The...

作者:底部填充胶 | 分类:TDS&MSDS | 浏览:1,727 views

HENKEL LOCTITE 190851(LPD221) UNDERFILL TDS

PRODUCT DESCRIPTION LOCTITE(TM) Product LPD-221 is a single component, epoxy adhesive designed for use as a reworkable underfill resin for CSP(FBGA) or BGA. It cures rapidly on exposure to heat. It is designed to give excellent protection from failure due to mechanical stress. The low viscosity allows filling in gap under CSP or BGA. ...

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RP-113178 Pick and Place Underfilm

RP-113178 Pick and Place Underfilm Features Enhances CSP and BGA solder joint reliability Reduces cost by combining pick and place plus soldering in one heating pass (no dispensing). No capital expense or equipment required Compatible with existing lead and Pb-free materials and reflow profiles. Air or nitrogen reflow co...

作者:底部填充胶 | 分类:TDS&MSDS | 浏览:2,025 views