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倒装片可修复底部填充材料的研究现状及发展
倒装片可修复底部填充材料的研究现状及发展
于鲲, 梁彤祥, 郭文利
(清华大学核能与新能源技术研究院, 北京100084)
摘要: 有机基板上的倒装芯片一般采用底部填充技术以提高其封装的可靠性。有缺陷的芯片在倒装后难以进行返工替换, 使得倒装芯片技术成本提高, 限制了此技术的应用。提出新型可修复底部填充材料的开发成为解决这一问题的有效途径。介绍了倒装芯片的可修复底部填充技术和可应用于可修复底部填充材料的技术要求, 并综述了国内外对于可修复底部填充材料的研究现状。
关键词: 底部填充; 可修复; 倒装芯片; 电子封装
中图分类号: TN305194 文献标识码: A 文章编号: 10032353X (2008) 0620466204
Development of Reworkable Underfill Materials for Flip Chip
Yu Kun , Liang Tongxiang , Guo Wenli
( Institute of Nuclear and New Energy Technology , Tsinghua University , Beijing 100084 , China)
Abstract : Flip2chip onto organic substrate becomes a mature process with a stable structure. Underfilltechnology effectively enhances the flip2chip cycle fatigue life and reliability of packaging process. The issuesof lack of reworkability limiting the final yield of this technology and leading to the increase of cost areanalyzed. It is pointed out that reworkable underfill is the key method for addressing nonreworkability of the underfill , so it is very important for electronic packaging. Reworkable underfill technology is reviewed , target performances and recent development of reworkable underfill materials are described.
Key words : underfill ; reworkable ; flip2chip ; electronic packaging EEACC : 0560
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