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覆晶封裝之流動及固化分析
覆晶封裝之流動及固化分析
Simulation of Flowing and Curing in Flip-Chip Packaging
林肇民[1] 王建順[2] Chao-Ming Lin Jiann-Shuenn Wang
吳鳳技術學院 電機工程系Department of Electrical Engineering, Wu-feng Institute of Technology
摘要：本研究是以射出成型之數值模擬方式探討不同之流道型式及入射波前造成覆晶封裝製程中封裝膠體流動及固化後之影響。在覆晶封裝製程中流動和固化是主要的兩個分析問題，其中流動方面必須考量流道、模具幾何和射壓；固化方面必須考量膠體特性、固化度和收縮。已完成之成果為對於不同角度之射口形式做數值模擬分析，包含延伸注膠口得到進入晶片區域之溶膠的波前(flow front)形式，並由不同之波前形式得到不同的壓力、應力及翹曲分布。結果顯示適當地延伸流道可以得到較均勻的應力及翹曲分佈。
關鍵詞：覆晶封裝、非均向性、晶片、射出成型
Abstract: In this paper, the injection molding numerical simulation of flip-chip packaging are carried out. The injection molding techniques of the IC packaging include chip packaging and encapsulation techniques that consist mainly of anisotropic cavity-filling and curing. The anisotropic cavity-fill process consists of runner, mold geometry, and pressure. The curing analysis consists of encapsulation, conversion, and shrinkage. The analysis of different runner-angles, flow front changes, pressure distribution, stress distribution, and warpage were finished. The results shown the extension runner can obtain better distribution in pressure, stress, and warpage.
Keywords: flip-chip packaging、anisotropic、chip、injection molding
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