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BGA Package Underfilm for Autoplacement

BGA Package Underfilm for Autoplacement
Jan Danvir
Tom Klosowiak

NIST-ATP Acknowledgment

AcknowledgmentProject Brief Microelectronics Manufacturing Infrastructure (October 1998)Wafer-Scale Applied Reworkable Fluxing Underfill for Direct Chip AttachDevelop new materials and technology needed to allow existing integrated-circuit fabrication facilities using conventional surface mount technology to handle new “direct chip attach” components, enabling more efficient production of these high-performance devices. Sponsor: Motorola, Inc.1301 East Algonquin RoadSchaumburg, IL 60196
•Project Performance Period: 4/9/1999 -10/8/2003Principal InvestigatorJanice DanvirActive Project Participants
oAuburn University (Auburn, AL)
oLoctiteCorporation (Rocky Hill, CT)ATP Project ManagerFrancis Barros, (301) 975-2617francis.barros@nist.govInserted

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