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HENKEL HYSOL 3508NH Cornerfill TDS

PRODUCT DESCRIPTION
3508NH provides the following product characteristics:
Technology Epoxy
Appearance Black
Cure Reflow
Product Benefits ● One component
● Reflow curable
● Eliminates post-reflow dispenses and
cure steps
● Reworkable
● Halogen free
● Improves mechanical reliability of
hand-held devices
Application Underfill
Typical Applications Reworkable CSP/BGA cornerfill
3508NH is designed to cure during Pb-free solder reflow while
allowing self-alignment of IC components. It can be pre-applied
to the board at the corners of the pad site using a standard
SMA dispenser.

 

DOWNLOAD FILE:HENKEL-HYSOL-3508NH-Cornerfill-TDS-EN

貌似是由underfill衍生出来的一款cornerfill胶水

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