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HENKEL LOCTITE 3128NH TDS

PRODUCT DESCRIPTION
3128NH provides the following product characteristics:
Technology Epoxy
Appearance Black viscous liquid
Components One component – requires no mixing
Product Benefits ● One component, requires no mixing
● Low temperature cure
● Low halogen content
Cure Heat Cure
Application Underfill
Typical Assembly
Applications
Memory cards and CCD/CMOS
3128NH edgebond material is designed to add reliability to chip
scale packages and other electronic components. It is a low
temperature cure adhesive ideal for use on heat sensitive
components.

DOWNLOAD FILES:HENKEL-LOCTITE-3128NH-TDS-EN

应该是乐泰低温胶3128的一个衍生产品,但作为传统underfill用途貌似有些牵强!

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