Hi-Tech Korea UNIQUE 3075BHF UNDERFILL TDS
时间:2016年04月07日 06:42:48 | 作者:底部填充胶 | 分类:TDS&MSDS | 浏览:8,097 views
1. PRODUCT DESCRIPTION
UNIQUE 3075BHF is a fast flow, reworkable, single component epoxy glue that is designed to improve the attachment strength of CSP & BGA or Flip Chip devices during mechanical stress testing such as drop and bending testing.
2. KEY FEATURES
* Excellent Chemical Resistance and Water-Proofing * Excellent Impact Resistance * Rapid Curing * Fast Flowing
DOWNLOAD FILES:UNIQUE-3075BHF-UNDERFILL-TDS
