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Hi-Tech Korea UNIQUE 3075BHF UNDERFILL TDS

1. PRODUCT DESCRIPTION

UNIQUE 3075BHF is a fast flow, reworkable, single component epoxy glue that is designed to improve the attachment strength of CSP & BGA or Flip Chip devices during mechanical stress testing such as drop and bending testing.

2. KEY FEATURES

* Excellent Chemical Resistance and Water-Proofing * Excellent Impact Resistance * Rapid Curing * Fast Flowing

 

DOWNLOAD FILES:UNIQUE-3075BHF-UNDERFILL-TDS

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