LOCTITE UNDERFILL PRODUCTS 3536
PRODUCT DESCRIPTION
3536™ provides the following product characteristics:
Technology Epoxy
Appearance Black
Components One component
Product Benefits • Reworkable
• Cures rapidly at low temperatures
• Minimizes thermal stress
• Rapid device throughput
• Excellent protection for solder joints agains mechanical stress
Cure Heat Cure
Application Underfill
Typical Assembly Applications Chip scale packages and BGA
3536™ epoxy reworkable underfill is designed to provide protection for solder joints against mechanical stress such as shock, drop and vibration.
TYPICAL PROPERTIES OF UNCURED MATERIAL
Viscosity, Brookfield , 25 °C, mPa•s (cP): CP52/20 1,800
Pot Life @ 25ºC, days >14
Shelf Life @ 2 to 8°C, months 6
Flash Point – See MSDS
TYPICAL CURING PERFORMANCE
Recommended Cure Schedule
5 minutes @ 120°C
2 minutes @ 130°C
Curing above 140°C is not recommended.
The above cure profile is a guideline recommendation. Cure conditions (time and temperature) may vary based on customers’ experience and their application requirements, as well as customer curing equipment, oven loading and actual oven temperatures.
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loctite 3536 TDS (55.7 KB, 2 次)
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