Reains Underfilm Introduction
Why Underfill/Underfilm
Solder joint Cracking due to Pb-free solder application
Must apply underfill or underfill film to enhance the solder reliabilities
Thermal Bond UF Advantage
• Efficiency Application
1. Reflowable thermal bonding film are easily chip on the circuit board use standard SMT machine and reflow profile, No extra space, equipment
and manpower required.
2. Improve productivity and lower misplacement.
3. Lower melting temperature and fast rework process on failure PCB, 100% repair yield with no residua left and Zero scrap during rework.
4. Better capillary and wetting performance under the BGA/POP.
5. Applied selectively only on where they are needed.
• Quality
1. High strength for lead free solder joint enhancement and passed reliability testing in mobile phone manufacturing 7 years.
Cost
1. Medium level component and low operation cost.
2. No extra equipment, space and manpower investment, High efficiency SMT process makes low conversion cost for manufacturing.
3. 100% rework and Zero scrap during rework make the lowest scrap cost.
4. Better capillary and wetting performance under the BGA/POP.
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