RP-113178 Pick and Place Underfilm
时间:2016年03月21日 03:36:06 | 作者:底部填充胶 | 分类:TDS&MSDS | 浏览:5,187 views
RP-113178 Pick and Place Underfilm
Features
Enhances CSP and BGA solder joint reliability
Reduces cost by combining pick and place plus soldering
in one heating pass (no dispensing).
No capital expense or equipment required
Compatible with existing lead and Pb-free materials and
reflow profiles.
Air or nitrogen reflow compatible
Requires no pre-baking of boards
Reworkable
RoHS compatible
AOI easy recognition
download files: RP-113178 Pick and Place Underfilm
