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Guideline for Selection and Application of Underfill Material for Flip Chip and other Micropackages

Guideline for Selection and Application of  Underfill Material   for Flip Chip and other Micropackages
Draft 7
Underfill Adhesives for  Flip Chip Applications Task Group (5-24f)

J-STD-030
Guideline for Selection and Application of Underfill Material
for Flip Chip and other Micropackages
Draft 7 – Dec 2000
Table of Contents
1 SCOPE
1.1 Purpose
1.2 Intent
2 APPLICABLE DOCUMENTS
2.1 IPC
2.2 Joint Industry Standard
2.3 American Society for Testing and Materials (ASTM)
3 TERMS AND DEFINITIONS
4 BACKGROUND – WHY IS UNDERFILL NEEDED, TYPE OF UNDERFILL
5 DESIGN CONSIDERATIONS – NEED MORE INFO ABOUT WHAT TO CONSIDER IF UNDERFILL IS USED
5.1 Footprint Design
5.2 Pad Redistribution
5.3 Gap Size
6 RAW MATERIALS CHARACTERISTICS – NEED MORE INFO ON RESIN/LIQUID PROPERTIES
6.1 Filler Properties
6.1.1 Filler Size
6.1.2 Filler Material Type
6.1.3 Percent by Weight
6.1.4 Density
6.2 Viscosity
6.3 Gel Time
6.4 Flux Compatibility
6.5 Alpha Particle Emissions
7 MATERIALS PACKAGING, HANDLING AND STORAGE
7.1 Packaging
7.1.1 Containers
7.1.2 Voids/Bubbles in Packed Material
7.2 Storage Conditions
7.3 Preconditioning
7.4 Usage Life (Shelf Life)
7.4.1 Viscosity Change
7.4.2 Flow Rate Change
7.4.3 Settling Test
8 APPLICATION PROCESS
8.1 Dispensing Procedures
8.2 Dispensing Patterns
8.3 Process Parameters
8.4 Flow Rate
8.4.1 Dispense Flow Rate Measurement
8.4.2 Underfill Flow Rate
8.5 Flow Out and Bleed
8.6 Spread/Slump
8.7 Application Problems
8.7.1 Air Entrapment
8.7.2 Phase Separation
8.7.2.1 Gravitational Phase Separation
8.7.2.2 Dynamic Phase Separation
8.7.2.3 Filtering Phase Separation
8.8 Evaluation Methodology
8.8.1 Acoustic Micro-Imaging 
8.8.2 Assembly to Glass for Flow Visualization
8.9 Pot Life (In Dispenser)
9 CURE PROCESS – INFO ON UNDERCURED

9.1 Applied Life (After Dispensing)
9.2 Process Parameters
9.2.1 Cure Schedule
9.2.2 Heating Rate 
9.3 Void Formation/Outgassing
9.4 Cure Verification
10 CURED UNDERFILL CHARACTERISTICS
10.1 Appearance
10.1.1 Fillet formation
10.1.2 Color (Dye/Pigment
10.2 Adhesion
10.2.1 Die Shear
10.2.2 Tensile Strength (Stud Pull)
10.2.3 Lap Shear/Peel Strength
10.3 Shrinkage and Induced Stress
10.4 Young’s Modulus
10.5 Coefficient of Thermal Expansion (CTE)
10.6 Glass Transition Temperature (Tg)
10.7 Flammability
10.8 Chemical Stability
10.8.1 Resistance to Solvents
10.9 Moisture Absorption
10.10 Hydrolytic Stability
10.11 Non-Nutrient
10.12 Surface Insulation Resistance
10.13 Electrochemical Migration Resistance
10.14 Volume Resistivity
10.15 Dielectric Constant
11 WORKMANSHIP
11.1 Substrate Preparation
11.2 Cleaning Before Underfill
11.3 Cleaning After Cure
12 RELIABILITY
12.1 Ionic Content
12.2 Chemical Resistance
12.3 Mechanical Integrity
12.4 Temperature and Humidity
12.5 Post Soldering Processes
12.6 Temperature Cycling
12.7 Moisture Resistance
13 OTHER CONSIDERATIONS – ADD FUTURE DEVELOPMENT TREND
13.1 Self Fluxing
13.2 Reworkability
13.3 Curing Indication – Conflict, 10.1 implies existence already
13.4 Thermal Management
14 TROUBLE-SHOOTING
14.1 Inadequate Flow
14.1.1 Viscosity
14.1.2 Wetting
14.1.3 Mechanical Blockage
14.2 Phase Separation
14.3 Voids
14.3.1 Voids Before Cure
14.3.2 Voids After Cure
14.4 Inadequate Cure
14.5 Poor Adhesion
14.6 Thermal Cycle Failure

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