HYSOL UNDEERFILL FP4526 TDS
PRODUCT DESCRIPTION
FP4526™ provides the following product characteristics:
Technology Epoxy
Appearance Blue
Product Benefits
• Low viscosity
• Fast flow
• Excellent wettability
• Excellent adhesion
• Ideal for high reliability
Applications • Hi-Pb and Pb-free applications
Filler Weight, % 63
Cure Heat cure
Application Underfill
Substrates Ceramic, Organic, Solder mask andPolyimide
Typical Package Application Ceramic packages and FC on flex
FP4526™ epoxy underfill is designed for capillary flow on flip chip applications.
TYPICAL PROPERTIES OF UNCURED MATERIAL
Viscosity, Brookfield – Cone & Plate, 25 °C, mPa•s (cP): Spindle 52, speed 10 rpm 4,700
Specific Gravity 1.7
Particle Size, μm, maximum 27
Flow Rate, @ 90 °C,3 mil gap,0.5 inch flow, seconds 30
Pot Life @ 25ºC, hours 36
Gel Time @ 121ºC, minutes 9
Shelf Life @ -40°C, months 9
Flash Point – See MSDS
TYPICAL CURING PERFORMANCE
Recommended Cure Schedule 15 minutes @ 165°C (Heat sink or hot plate cure)
Alternative Cure Schedule 30 minutes @ 165°C (Convection oven)
With all fast cure systems, the minimum required time for cure depends on the rate of heating. Conditions where a hot plate or a heat sink is used are optimum for fastest cure. Cure rates depend on the mass of material to be heated and intimate contact with the heat source.
DOWNLOAD PDF FILE:
HYSOL UNDEERFILL FP4526 (67.4 KB, 6 次)
您没有权限下载此文件。
