PACKAGING MATERIALS Hysol® Underfills
Modern hand held devices and the trend toward thinner, less rigid PCBs are driving the demand for improved shock resistance and increased electronic device reliability.
Hysol® package level underfill encapsulants meet stringent JEDEC testing requirements and are compatible with the high temperature processing required for lead-free assembly. Our environmentally friendly materials are developed to meet demanding end-use requirements, including low warpage/low stress, fine pitch, high reliability, and high adhesion.
Hysol® CSP/BGA underfills offer easy reworkability as well as excellent vibration and impact resistance. These underfills offer many processing advantages such as fast flow, fast cure, and long pot life. Our CornerbondTM technology fits easily into an SMT process flow and eliminates a separate underfill dispense and cure process, saving time and money.
The industry standard for flip chip, Hysol® underfills are used in devices such as FC CSPs and FC BGAs for ASICs, chipsets, graphics chips, digital processors, and microprocessors.These fast flow materials permeate easily under large die. Offering excellent adhesion when used with a variety of no-clean fluxes, these underfills will not crack after thermal shock or thermal cycling.
The latest technology from Henkel includes underfills for low-k die, new chemistries offering pot life measured in weeks instead of hours, and high throughput Snap Cure processing.
Further innovations include unique reworkable formulations, fluxing noflow underfills, wafer/pre-applied for flip chip and CSPs, and pre-applied cornerbond adhesives for CSPs that eliminate post-reflow dispense and cure steps.
Henkel is partnering with leading technology companies and research universities to develop future technologies to support forthcoming nanometer-scale semiconductor devices.
download pdf file:
乐泰hysol UNDERFILL资料 (341.7 KB, 2 次)
您没有权限下载此文件。
