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新型可返工环氧底部填充料的合成和性能

童凌杰,王鹏,肖斐
(复旦大学材料科学系,上海200433)

摘要:合成了两种分别含有叔酯键和叔醚键的环氧化合物EP – 1 和EP – 2,其结构通过红外光谱、氢核磁共振谱及环氧当量测定等方法得到证实。EP – 1 与已有商品ERL – 4221 以环氧物质的量比1:1 混合组成EP – 3。EP – 2 和EP – 3 用酸酐类固化剂HMPA 固化。TGA 测试表明它们具有理想的起始热分解温度( IDT = 210 ~ 220℃),显著低于现在普遍应用的环氧底部填充料ERL -4221(IDT = 310℃)。它们的粘结强度和玻璃化转变温度Tg在返工温度(225℃)老化数分钟后迅速降低,可以满足当前微电子倒装芯片封装对可返修工艺的要求。

关键词:可返工;底部填充料;环氧树脂;倒装芯片;热降解

中图分类号:TB34;TQ436 文献标识码:A

Synthesis and properties of novel controlled thermally degradable epoxy resin for electronic packaging
TONG Ling – jie,WANG Peng,XIAO Fei
(Department of Materials Science,Fudan University,Shanghai 200433,China)

Abstract:The synthesis,formulation and characterizations of two new diepoxides were reported,one diepoxide contains tertiary ester(EP – 1)and the other contains tertiary ether linkages(EP – 2). Both compounds were characterized with 1H – NMR and FT – IR and formulated into underfill materials with an anhydride as hardener and a 2 – methylimidazole as catalyst. A dual – epoxy system(EP – 3)was also formulated with the tertiary ester diepoxide and a conventional aliphatic diepoxide,ERL – 4221,using the same hardener and catalyst. The thermogravimetric analysis(TGA)reveals that the cured EP – 2 and EP – 3 had obviously lower thermal decomposition onset temperature(around 215℃)than ERL – 4221 (310℃). The shear strength and glass transition temperatures of these novel diepoxides decreas quickly upon being aged at 225℃. The unusual thermal degradable properties make these compounds a potential use as reworkable underfill for flip – chip application.
Key words:reworkable;underfill materials;diepoxide;flip – chip;thermal degradation

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