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HYSOL UNDERFILL UF3800 TDS

PRODUCT DESCRIPTION
UF3800 provides the following product characteristics:
Technology                                                                       Epoxy
Appearance                                                                       Black liquid
Cure                                                                                       Heat cure
Application                                                                        Underfill
Typical Package     Application             Chip scale packages and BGA
Product Benefits
• One component
• Reworkable
• Fast cure at moderate temperatures
• Minimal stress on other components
• High Tg
• Compatible with most Pb-free and halogen-free solders
• Stable electrical performance in  Temperature Humidity Bias
UF3800 reworkable epoxy underfill is designed for CSP and BGA applications. It cures quickly at moderate temperatures to minimize stress to other components, and when cured provides excellent mechanical stress protection for solder joints.

 

TYPICAL PROPERTIES OF UNCURED MATERIAL

Viscosity @ 25°C, mPa    Physica MCR100,   Spindle CP50-1, 1000S-1        375
Specific Gravity             1.13
Pot Life @ 25ºC, days      3
Shelf Life @ -20°C, months       9
Flash Point – See MSDS

TYPICAL CURING PERFORMANCE
Cure Schedule                     ≥8 minutes @ 130°C

 

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