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Hysol Underfill

The proliferation of handheld
devices and the trend toward
thinner, less rigid PCB’s are
driving the demand for improved
shock resistance and increased
electronic device reliability.
Hysol® package level underfill encapsulants
meet stringent JEDEC level testing requirements
and are compatible with the high temperature
processing required for lead free assembly. Our green
materials are developed to meet demanding end use
requirements, including low warpage/low stress, fine pitch, high
reliability, and high adhesion.
Hysol® CSP/BGA underfills offer easy reworkability as well as excellent vibration and impact
resistance. These underfills offer many processing advantages such as fast flow, fast cure, and
long pot life. Our new Cornerbond technology fits easily into an SMT process flow and
eliminates a separate underfill dispense and cure process, saving time
and money.
The industry standard for flip chip, Hysol® underfills are used in devices such as FC CSPs and
FC BGAs for ASICs, chipsets, graphics chips, digital processors, and microprocessors. These
fast flow materials permeate easily under large die. Offering excellent adhesion when used
with a variety of no-clean fluxes, these underfills will not crack after thermal shock or
thermal cycling.
The latest technology from Henkel Loctite includes underfills for low k die, new chemistries
offering pot life measured in weeks, rather than hours, fast flowing snap cure, unique
reworkable formulations, fluxing no-flow underfills, wafer/pre applied for flip chip and CSPs,
and preapplied corner bond adhesives for CSPs that eliminate post-reflow
dispense and cure steps.
Henkel Loctite is partnering with leading technology companies and research universities to
develop future technologies such as low k dielectric underfills, wafer-applied, reworkable
and fluxing underfills for direct microchip attachment.

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