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Hysol package level underfill

The proliferation of handheld devices and the trend toward thinner, less rigid PCB’s are driving the demand for improved shock resistance and increased electronic device reliability.

Hysol® package level underfill encapsulants meet stringent JEDEC level testing requirements and are compatible with the high temperature processing required for lead free assembly. Our green materials are developed to meet demanding end use requirements, including low warpage/low stress, fine pitch, high reliability, and high adhesion.

Hysol® CSP/BGA underfills offer easy reworkability as well as excellent vibration and impact resistance. These underfills offer many processing advantages such as fast flow, fast cure, and long pot life. Our new Cornerbond technology fits easily into an SMT process flow and eliminates a separate underfill dispense and cure process, saving time and money.

The industry standard for flip chip, Hysol® underfills are used in devices such as FC CSPs and FC BGAs for ASICs, chipsets, graphics chips, digital processors, and microprocessors. These fast flow materials permeate easily under large die. Offering excellent adhesion when used with a variety of no-clean fluxes, these underfills will not crack after thermal shock or thermal cycling.

The latest technology from Henkel Loctite includes underfills for low k die, new chemistries offering pot life measured in weeks, rather than hours, fast flowing snap cure, unique reworkable formulations, fluxing no-flow underfills, wafer/pre applied for flip chip and CSPs, and preapplied corner bond adhesives for CSPs that eliminate post-reflow dispense and cure steps.

Henkel Loctite is partnering with leading technology companies and research universities to develop future technologies such as low k dielectric underfills, wafer-applied, reworkable and fluxing underfills for direct microchip attachment.

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