US Patent Publication No-flow underfill composition and method
No-flow underfill composition and method
US Patent Publication (Source: USPTO)
Publication No. US 7619318 B2 published on 17-Nov-2009
Application No. US 11/238596 filed on 29-Sep-2005
Abstract (English)
In some embodiments, a method includes providing a composition which includes a base at least partially filled with filler particles and applying the composition as an underfill composition. At least some of the filler particles are electrically conductive.
Inventors/Applicants
Rumer, Christopher L. [+3]
Chandler, AZ, US
Assignees
Intel Corporation
Santa Clara, CA, US
Classifications
International (2006.01): H01L 23/29
National: 257/789; 257/787; 257/795
Field of Search: 257/787; 257/789; 257/795; 252/511; 252/514
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