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DSP点underfill膠后烘烤出現氣泡

ietiantang 2009-09-02 15:20 DSP点underfill膠后烘烤出現氣泡 DSP四周點underfill膠體經過抽真空后,在110°烘烤30分鐘,DSP四周出現氣泡問題。 DSP是SN9C230CJG-LF(46-PIN QFN)6.5*4.5*0.85MM SONIX(SERTEK) 不知道哪位能否幫忙解決   ietiantang 2009-09-02 16:42 怎么没人看啊,来人帮帮我...

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Rework of Underfilled Device

Rework of Underfilled Device Underfills  protect the active surface of the die of flip chips, BGA ad CSP package types while improving their reliability by distributing stress away from the solder interconnects. This increases the performance of products in meeting drop, shock and bend criteria. Newer underfills are specifically des...

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How to Remove a Flip Chip’s Underfill

Introduced by IBM in the 1960s, a flip chip is a computer chip that is attached to a motherboard with solder instead of tiny wires. Underfill is a polymer placed under a flip chip to fill the space between the chip and the motherboard. It protects the active surface of the flip chip from being damaged. If a flip chip is removed from th...

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Underfill Jetting & Dispensing

Underfill Jetting & Dispensing Underfill is used in a wide variety of packages and board level assemblies. Flip chip in package, direct chip attach on boards, stacked die packages, and various BGA assemblies are places where underfill is being used in production today. The "part" to be underfilled can be either a die or the BGA su...

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Underfill Rework

Underfill Rework Underfilled components are used in consumer electronic products (mobile devices, portable computers etc.), in the automotive industry (sensor modules, engine control units etc.) or whenever flip chips are incorporated in products with maximum miniaturization. An underfilled chip contributes to an improved ove...

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623 Underfill Epoxy

DESCRIPTION Underfill 623 is a non-odorous, low surface tension, one component epoxy resin designed for use as a capillary flow underfill for flip chip, CSP, BGA and uBGA assemblies. Underfill 623 offers excellent capillary action for flat, fast and complete spread. Underfill 623 offers superior reliability through high Tg, low CTE,...

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Empfasis – Flip Chip Underfill Processing

With today’s advancements in component packaging, dispensing has become a more critical part of the electronics manufacturing line. Consequently, the increasing popularity of such processes as flip chip underfilling has led to complications in the industry, primarily because it has added a process step involving strict attentio...

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Micro-gap Filling for TSV Package and Simple Underfill Process for TSV Stacking

Micro-gap Filling for TSV Package and Simple Underfill Process for TSV Stacking   IP.com Prior Art Database Disclosure (Source: IPCOM) Disclosure Number IPCOM000171102D dated 09-Jun-2008 Originally published in The IP.com Journal v8n6A Disclosed by: Siemens AG Country: Germany Copyright: Qimonda 2008 Related People...

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Reworkable Underfill Encapsulant for BGA’s

Reworkable Underfill Encapsulant for BGA's Apr 27, 2004 CN-1453 Before Removal After BGA Removal and Site Clean-up EAST HANOVER, NJ � Zymet has introduced a new reworkable BGA underfill encapsulant, CN-1453. It is a silica filled version of the company�s earlier CN-1432, so i...

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BGA Underfill Alternative

BGA Underfill Alternative Back when RoHS was just an idea, one of the big concerns was the fear of mechanical reliability with lead-free BGAs. A lot of study went into the solder mixes and it's now history, but there is still some concern. Especially in hi-shock prone applications. Sometimes I recommend that the engineer go alon...

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