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Underfill component
- Avoid disturbance of neighboured components on small-sized (pitch down to 400 µm or below) high-density SMD assemblies with distance down to 300 µm
- Process fluctuations during production result in undefined fillet shapes
- Avoid thermal and mechanical stress to the surface top metal layer and solder resist
- Find the appropriate process according to the specific underfill material
- Variable stack heights require adaptive tooling and specialized rework equipment
Underfill Rework
时间:2012年03月14日 11:58:29 | 作者:admin | 分类:Q&A | 浏览:8,314 views
Underfill Rework
Underfilled components are used in consumer electronic products (mobile devices, portable computers etc.), in the automotive industry (sensor modules, engine control units etc.) or whenever flip chips are incorporated in products with maximum miniaturization.
An underfilled chip contributes to an improved overall product quality, offering higher reliability and better lifetime. The underfill material provides protection against humidity, thermal stress and all kinds of mechanical impact.
Reworking components with rework-able underfill is applicable if the components or substrates are expensive, hard to obtain or if complete products need to be saved.
