PROCESS-GUIDELINE FOR CSP/BGA UNDERFILLS ON BOARD ASSEMBLY LEVEL
时间:2012年02月06日 05:59:54 | 作者:admin | 分类:Article | 浏览:11,276 views
PROCESS-GUIDELINE FOR CSP/BGA UNDERFILLS ON BOARD ASSEMBLY LEVEL
Prepared by: Josef Schneider
Tests performed by: Andreas Karch, Antje Dümmig
Edition: August 24th, 2001
TABLE OF CONTENTS
1. NECESSITY FOR UNDERFILL 3
2. UNDERFILL DIFFERENTIATION 3
3. UNDERFILL SELECTION 4
4. UNDERFILL MATERIALS FOR BGA/CSP 4
5. ASSEMBLY PROCESS RECOMMENDATIONS 5
6. PROCEDURE FOR STORAGE/THAWING/DISPOSAL 8
7. BOARD LEVEL RELIABILITY RESULTS 8
8. REWORK PROCEDURE FOR 3513 + HYSOL FP6100 12
9. SUMMARY 13
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