Underfill Overmold Low k chip & Lead Free Bump
时间:2012年02月05日 05:39:44 | 作者:admin | 分类:Q&A | 浏览:6,699 views
Underfill Overmold ~ Low k chip & Lead Free Bump ~
Underfill ~ CRP-4120series ~
Good adhesion to molding compound
Molding Compound
~ EME-G series ~
Sumitomo Bakelite Co., Ltd.,
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overmold_underfill_mar (482.4 KB, 1 次)
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