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Indium NF260 No-Flow Underfi ll

Introduction
NF260 is a No-Flow Underfill, designed for Chip Scale
Package (CSP) and BGA or Flip-Chip assemblies using
a single refl ow process. It offers both a fl uxing and
underfi lling capability for the chip while providing
increased reliability and environmental protection.
Designed for the Pb-Free soldering process, NF260 is
fully compatible with the SMT process and offers a wide
process window for solder refl ow and underfi ll curing.
The underfi ll curing is completed in one refl ow pass and
no post cure is required. NF260 not only reduces costs
over capillary fl ow underfi lls, but also achieves higher
yields.

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