ZYMET CN1703 UNDERFILL TDS
时间:2011年12月23日 07:45:26 | 作者:admin | 分类:TDS&MSDS | 浏览:7,739 views
REWORKABLE CSP and BGA UNDERFILL ENCAPSULANT
CN-1703 is a reworkable underfill encapsulant for CSP and BGA encapsulation that cures quickly at low temperature. It is capable of flowing quickly across distances of 750 mils and greater. This encapsulant exhibits excellent adhesion to organic substrates.
TYPICAL PROPERTIES
Color Cloudy
Ash Content, wt% 0
Viscosity (cps) SSA #21, 100 RPM, 25°C 450
Cure Conditions, minutes 120°C 5
150°C 1
Specific Gravity 1.16
Shelf Life @ -5°C, months 6
Pot Life @ 25°C, days 14
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