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Underfill for Electronic Component Assembly
Underfill for Electronic Component Assembly
Nordson ASYMTEK dispensing systems are used to underfill more flip chip packages in the world than any other dispensing system supplier. From the early days of underfill dispensing with linear pumps to high speed jet dispensing, Nordson ASYMTEK has been on the leading edge of technology development to make the user’s job easier.
Nordson ASYMTEK has a full range of options from small prototype to inline high-speed dispensing systems to meet all users’ needs for high speed, precision underfill requirements.
Ask us about fids on the fly, range finding or one of the many other time saving features Nordson ASYMTEK can provide for demanding situations.
Nordson ASYMTEK also offers solutions for second-level underfill for CSPs, BGAs, or PoPs, as well as no-flow underfill and jetting encapsulation technologies.
