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大小倒装芯片的快速底部填充制程(英文版)

FAST UNDERFILL PROCESSES FOR LARGE TO SMALL FLIP CHIPS

ABSTRACT
The biggest conceptual impediment to capillary underfill isthe perception that the process is a major bottleneck in the production line. However, in the last few years, great strides have been made in equipment, materials and dispensing processes that have removed underfill as a bottleneck. A combination of substrate temperature, material, equipment and dispense process can show complete flow out under a 25mm square die with 60μm gap in under 35 seconds. The optimization of throughput in a production line is achieved by matching the dispense time to the flow out time of the capillary underfill. This paper covers the combinations and configurations of dispensing processes & equipment and the flow out theory to achieve maximum throughput. Capillary flow models used for today’s geometries are shown to be valid and accurate for significant different form factor products of the future, large die with small gap (LDSG). Flow out time data for LDSG densely populated arrays with several thousand interconnections is presented. Process variables and material parameters that influence capillary fluid flow are examined.

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