CSP and BGA Underfill
CSP and BGA Underfill
Non-contact jet dispensing is ideal to underfill chip scale packages (CSPs) and ball grid arrays (BGAs) on board as well as package-on-packages (PoPs). With Control Process Jetting (CpJ), Nordson ASYMTEK’s jetting systems automatically manage the critical processes related to underfilling these packages.
CSP devices, when used in portable electronic equipment, have been found to be more reliable when an underfill is used to encapsulate the solder joints.
To build electronic assemblies in high volume requires high-speed, precision dispensing. In many CSP applications, it is critical to dispense precise volumes of fluid to provide protection for the solder balls without wasting expensive encapsulation material. The dispensing also needs to automatically compensate for changes in fluid viscosity over the pot life of the material. In addition, Nordson ASYMTEK offers a range of underfill techniques, including no-flow underfill and jetting encapsulation technologies. For more about flip chip underfill and first-level underfill for electronic component assemblies, visit this page under Semiconductor Packaging Solutions.
