Speedline Technologies – Process/Applications-UNDERFILL
PROCESS/APPLICATIONS > UNDERFILL
Underfill is the process of applying a specially engineered epoxy to fill the area between the die and the carrier. Underfill materials are designed to control the stress on the solder joints. This stress is caused by either the difference in thermal expansion between the silicon die and the carrier or physical stresses caused by vibration or drop shock. Once cured, the underfill absorbs the stress, reducing the strain on the solder bumps, greatly increasing the life of the finished package. Underfill is typically applied using a capillary flow process where material is dispensed next to a bonded flip chip and allowed to “wick” under the die.
A host of Speedline dispensing, ranging from very high volume to low volume, both inline and batch configurations, are available to deliver faster, more efficient, and more cost effective solutions to a variety of underfill applications.
Dispense Unit (DU) Technology