Underfill for High-end Application

Hitachi Chemical Co.,Ltd Semiconductor Materials Div. FC-BGA CUF (solder bump) NUF (solder bump) Stacked CSP CUF (solder bump) NUF (solder bump) NCP (Au bump) Stacked Die TH Electrode CUF (High flow) NUF (Voidless) CUF:Capillary flow underfill NUF:Non flow underfill Working on Wonders Flip Chip Trend Silicon ch...

作者:admin | 分类:Article | 浏览:7,813 views

THE CHEMISTRY & PHYSICS OF UNDERFILL

Dr. Ken Gilleo ET-Trends gilleo@ieee.org Abstract Underfill is today’s polymer magic that enables the increasingly popular 2nd generation Flip Chip - lower cost assembly on organic substrate. This paper will provide a basic understanding of the chemistry of underfills and the physical properties that are important to their succes...

作者:admin | 分类:Papers | 浏览:6,347 views

Underfill 공법

1. 언더필(Underfill)이란? 언어적 의미 그대로 밑을 메운다는 뜻입니다. 즉 BGA, CSP, Flip Chip등의 Package 밑을 절연 수지를 이용하여 완전히 메우는 공법을 말합니다. 2. 언더필을 굳이 해야할 필요가 있나요? 물론 모든 부품에 반드시 해야 하는 것은 아닙니다. 가장 좋은 설계는 언더필을 하지 않고도 시장에서 장시간 불량이 발생하지 않도록 하는 ...

作者:admin | 分类:언더필수지 | 浏览:11,736 views

CornerBond一点资料

最近遇到一些cornerbond用途的客户，上网找了找发现现在关于cornerbond和edgebond的资料还是挺多的，提供一个资料供大家学习。 Corner Bonding of CSPs: Processing and Reliability Guoyun Tian, Yueli Liu, R. Wayne Johnson, Pradeep Lall, Mike Palmer, & Nokib Islam Laboratory for Electronics Assembly & Packaging – Auburn University 162 Brou...

作者:风间飞猪 | 分类:Papers | 浏览:10,996 views

“No Flow” Underfill Reliability is Here

“No Flow” Underfill Reliability is Here Michael A. Previti Cookson Semiconductor Packaging Materials 200 Technology Drive Alpharetta, GA 30005  www.cooksonsemi.com Abstract Properly formulated no flow underfills decrease manufacturing time and cost of producing flip chip packages. Flip Chip strives to become the ultimate...

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STICK 1 UNDERFILL 5650规格书

STICK 1 UNDERFILL 5650规格书   download：[download id="56"]

作者:admin | 分类:TDS&MSDS | 浏览:23,221 views

表面張力與接觸角變化對覆晶封裝底部填膠流動的影響

表面張力與接觸角變化對覆晶封裝底部填膠流動的影響 王永元、張榮語* 清華大學化工系 In this work, the capillary flow, which is influenced by the surface tension of encapsulant and the contact angle between encapsulant, bumps and substrate, of dispensing process for flip chip underfill is discussed by theoretical and numerical an...

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覆晶封裝之流動及固化分析

覆晶封裝之流動及固化分析 Simulation of Flowing and Curing in Flip-Chip Packaging 林肇民[1] 王建順[2]  Chao-Ming Lin Jiann-Shuenn Wang 吳鳳技術學院 電機工程系Department of Electrical Engineering,  Wu-feng Institute of Technology 摘要：本研究是以射出成型之數值模擬方式探討不同之流道型式及入射波前造成覆晶封裝製程中封裝膠體流動及固化...

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底部填充工艺的持续优化

底部填充工艺的持续优化   download pdf file：[download id="53"]

作者:admin | 分类:Article | 浏览:7,475 views

底填封膠製程參數優化研究

底填封膠製程參數優化研究 黃乾怡 陳重任 華梵大學工業工程與經營資訊研究所 jayhuang@cc.hfu.edu.tw ；m9101009@cat.hfu.edu.tw 摘要 為了提昇電子產品的可靠度，製造過程中通常會針對電路板上的重要元件進行底填封膠（Underfill）點膠製程。本研究中乃是以玻片模擬底填封膠在元件基板與印刷電路板間隙層內的流動行為。在實驗過程中，考量底填封膠的黏稠度...

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