当前位置：首页 > TDS&MSDS

HENKEL HYSOL 3508NH Cornerfill TDS

PRODUCT DESCRIPTION 3508NH provides the following product characteristics: Technology Epoxy Appearance Black Cure Reflow Product Benefits ● One component ● Reflow curable ● Eliminates post-reflow dispenses and cure steps ● Reworkable ● Halogen free ● Improves mechanical reliability of hand-held devices Application Underfil...

作者:底部填充胶 | 分类:TDS&MSDS | 浏览:9,517 views

HENKEL LOCTITE 3128NH TDS

PRODUCT DESCRIPTION 3128NH provides the following product characteristics: Technology Epoxy Appearance Black viscous liquid Components One component - requires no mixing Product Benefits ● One component, requires no mixing ● Low temperature cure ● Low halogen content Cure Heat Cure Application Underfill Typical Assembly Appl...

作者:底部填充胶 | 分类:TDS&MSDS | 浏览:11,427 views

HENKEL LOCTITE 190967 UNDERFILL TDS EN

LOCTITE® 190967™is a single component, epoxy adhesive developed as reworkable CSP underfill. It cures rapidly at low temperature on exposure to heat. It is designed to give excellent protection of assembled devices from failure due to physical impact and/or thermal cycling. The low viscosity allows filling in gaps under CSP or BGA. The...

作者:底部填充胶 | 分类:TDS&MSDS | 浏览:5,668 views

HENKEL HYSOL UNDERFILL UF3707 TDS

PRODUCT DESCRIPTION UF3037 provides the following product characteristics: Technology Epoxy Appearance Black liquid Product Benefits ● One component ● Reworkable ● Fast cure at low temperatures ● Compatible with most Pb-free and halogen-free solders ● Very good impact and thermal cycle resistant performance Cure Heat cure A...

作者:底部填充胶 | 分类:TDS&MSDS | 浏览:4,190 views

HENKEL LOCTITE ECCOBOND UNDERFILL 3915 TDS

PRODUCT DESCRIPTION LOCTITE ECCOBOND UF 3915 provides the following product characteristics: Technology Epoxy Appearance Black liquid Cure Snap Cure or Heat cure Product Benefits ● Halogen free ● One component ● Snap curable ● Fast flow ● High Tg ● Easy rework ● High fracture toughness ● Excellent thermal cycle performance...

作者:底部填充胶 | 分类:TDS&MSDS | 浏览:5,915 views

汉高推出可用于精密细间距阵列元件的可返修底部填充胶

汉高最新研发的LOCTITE UF3810，是对其先进底部填充胶材料的再次扩充，它采用一种全新的底部填充技术，具有非常卓越的高可靠性能，同时相比以往的几代产品而言，返修更加方便。 LOCTITE UF3810 本着更加出色的性能以及易于使用的原则而设计完成，满足今天高产率设备的多种复杂要求，并兼顾工艺的可操作性。新产品为无铅材料，完全可返修，玻璃转化温度高达100℃...

作者:admin | 分类:Article | 浏览:7,954 views

Henkel develops reworkable underfill

In today’s electronic devices such as smartphones there are numerous complex engineering components. Expanding on its portfolio of advanced underfill materials, Henkel has developed Loctite UF3810, a new underfill technology that provides extremely high reliability while also enabling easier reworkability as compared to previous ge...

作者:admin | 分类:Article | 浏览:9,359 views

Henkel宣布推出下一代底部填充材料

Henkel宣布推出下一代底部填充材料  Henkel日前宣布，在底部填充材料领域取得显著突破，开发出可满足各种复杂需求的新型底部填充材料，其特性包括常温快速流动、低固化温度以及可返修性。这款新材料Hysol® UF3800™专为CSP、BGA等器件而设计，特别适用于当前的手持通讯设备和娱乐等应用。 Hysol UF3800 flows fast at room temperature and cures quickly at...

作者:admin | 分类:Q&A | 浏览:8,538 views