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Transforming Flip Chip Back Into a CSP with Reworkable Wafer-Level Underfill

Transforming Flip Chip Back Into a CSP with Reworkable Wafer-Level Underfill

Ken Gilleo – ET-Trends
David Blumel Alpha Metals

The Packaging Revolution
Flip Chip vs. CSP
Why Underfill?
Classes of Underfill
Final Generation FC; a CSP
Conclusions

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