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ProvidedSupplier: Protavic America, Inc.Description: Fast flow, fast cure capillary reworkable underfill. The rheology of the PROTAVIC ANA 10199 R in combination with its fineness make the product perfectly adapted to high reliability small gap underfill applications. It presents a good pot life at room temperature 20-22C and a high reactivitySupplier ProfileEmail Supplier -
Supplier: Protavic America, Inc.Description: Epoxy system commonly used as an underfill material. This material is designed to survive extreme heat and can be used on various sized BGA devices. It can be used for STB underfill protection applications.Supplier ProfileEmail Supplier
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Supplier: Epoxy TechnologyDescription: A two component, high Tg, high temperature grade epoxy designed for semiconductor, underfill, hard-disk drive and hybrid micro-electronics packaging applications. The epoxy can also be used for adhesive and sealing applications in electronics, optical, and medical devices.
- Material Type / Grade: Thermoset
- Chemical / Polymer System Type: Epoxy
- Compound Type: Liquid
- Features: Optical Grade
Supplier ProfileEmail Supplier -
Supplier: Polar Tech Industries, Inc.Description: Fiberglass reinforced tape is known for its excellent performance in high speed, overfill and underfillapplications. Consistent adhesive, coating and lamination Paper moisturized reduces curl, increases tape stretch & makes tape more flexible Larger 1-5/8” diameter cores assure
- Type: Single-Sided Adhesive
- Carrier / Backing Material: Paper
- Features: Removeable
Supplier ProfileGo To WebsiteEmail Supplier -
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ProvidedSupplier: Master Bond, Inc.Description: Master Bond Polymer System EP3RRLV is a one component, low viscosity tough epoxy for high performance potting, encapsulation and underfillapplications featuring rapid curing at temperatures as low as 220-250°F. This unique formulation offers high physical strength properties, good thermal- Substrate / Material Compatibility: Ceramic / Glass, Metal, Plastic, Porous Surfaces
- Industry: Automotive, Electronics, OEM / Industrial, Semiconductors / IC Packaging
- Chemical / Polymer System Type: Epoxy (EP)
- Cure Type / Technology: Single Component System, Specialty / Other
Supplier ProfileGo To WebsiteEmail Supplier -
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ProvidedSupplier: Protavic America, Inc.Description: Fast flow, fast cure capillary reworkable underfill. The rheology of the PROTAVIC ANA 10199 R in combination with its fineness make the product perfectly adapted to high reliability small gap underfill applications. It presents a good pot life at room temperature 20-22C and a high reactivitySupplier ProfileEmail Supplier -
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ProvidedSupplier: Protavic America, Inc.Description: Fast flow, fast cure capillary reworkable underfill. The rheology of the PROTAVIC ANA 10199 R in combination with its fineness make the product perfectly adapted to high reliability small gap underfill applications. It presents a good pot life at room temperature 20-22C and a high reactivitySupplier ProfileEmail Supplier -
No Image
ProvidedSupplier: Protavic America, Inc.Description: Fast flow, fast cure capillary reworkable underfill. The rheology of the PROTAVIC ANA 10199 R in combination with its fineness make the product perfectly adapted to high reliability small gap underfill applications. It presents a good pot life at room temperature 20-22C and a high reactivitySupplier ProfileEmail Supplier -
No Image
ProvidedSupplier: Protavic America, Inc.Description: Fast flow, fast cure capillary reworkable underfill. The rheology of the PROTAVIC ANA 10199 R in combination with its fineness make the product perfectly adapted to high reliability small gap underfill applications. It presents a good pot life at room temperature 20-22C and a high reactivitySupplier ProfileEmail Supplier -
No Image
ProvidedSupplier: Protavic America, Inc.Description: Fast flow, fast cure capillary reworkable underfill. The rheology of the PROTAVIC ANA 10199 R in combination with its fineness make the product perfectly adapted to high reliability small gap underfill applications. It presents a good pot life at room temperature 20-22C and a high reactivitySupplier ProfileEmail Supplier 
LORD Corporation
LORD ME-555 underfill encapsulantNew High Quality, Low Cost Underfill Encapsulant Developed for Semiconductor Packaging and Assembly Industries.
LORD ME-555 underfill encapsulant is a high purity, semiconductor grade epoxy underfill material for the encapsulation of flip chip devices. Developed to meet technical requirements of customers, LORD has been able to present this material with a significant cost… (read more)
Protavic America, Inc.
Fast Flow Underfill > ANE-20961Protavic® ANE-20961 is a fast flow, fast cure capillary underfill. (read more)
Browse Electrical and Electronic Resins Datasheets for Protavic America, Inc.
Epoxy Technology
EPO-TEK® 360 Optical Epoxy AdhesiveEPO-TEK® 360 is a two component, high-temperature grade epoxy for semiconductor, electronics, fiber optics and medical applications. (read more)
Max Machinery, Inc.
100 times the flow meter resolution for the same $When working at low flow rates, resolution is the key. The more pulses per millileter that your meter generates, the more significant figures you can generate to the right of the decimal place. You can get 60 to 140 times more pulses/ml for slightly more money than the mass produced gear meter you are currently using. (read more)
OK International, Inc.
MFX-2200 Particle and Gas Fume Filtration SystemsOK International’s multi-user MFX-2200 Series Fume Extraction Systems set a new benchmark in performance, delivering a maximum airflow of 900 m3/h and a maximum suction force of 1,075Pa. (read more)
Browse Mist Collectors and Fume Collectors Datasheets for OK International, Inc.
Epoxy Technology
EPO-TEK® 301 Spectrally Transparent EpoxyEPO-TEK® 301 is a two component, room temperature curing epoxy featuring very low viscosity, and excellent optical-mechanical properties. (read more)
- VIVID 3D Digitizer and Underfill Testing of Cast Parts (.pdf)
) For alignment, wooden-mold data (larger than finished part shapes taking the shrinkage allowance into consideration) are used and compared with the part data (of finished part shapes) to evaluate the underfill. 5) In a contour display, only overall tendencies can be determined. To make a final decision…
- Handling Procedures for Syringes of Frozen Underfill Encapsulants
Recommendations: The follow is recommended for storage and handling of frozen underfill encapsulant syringes. These recommendations should be used as guidelines in handling frozen underfill syringes because each product is unique and the thawing time and process may vary. We recommend trial…
- Study of RF Flip-Chip Assembly with Underfill Epoxy (.pdf)
Flip-chip assembly technology is becoming more and more important to radio frequency (RF) MCM with the following advantages: automated assembly, compact size, low cost, low cross talk, and low insertion loss. However, flip-chip assembly also demands carful evaluation of solder joint reliability….
- MICRO: Special Apps
, it consumes less material than spin coating. In addition to performing MEMS lithography applications, spray coating can be used to coat irregularly shaped or heavy substrates, coat many small substrates simultaneously, deposit a protective coating on top of fragile structures, and perform underfill steps…
- Medical Device Link .
. Although flip chips can sometimes be difficult to work with, when they are properly designed and executed, they are very reliable. A flip chip package design eliminates the problems associated with solder balls being missing, bridged, cracked, or voided. In addition, the underfill material fills…
- Thermal Enhancement of Systems using Organic Flip-Chip Packages (FC-PBGA) with an Alternate Cooling Path through the Printed Wiring Board
enhancement was considered. Ramakrishna and Lee [6] studied the effects of underfill,. Nomenclature. thermal balls, heat spreader, and overmold on the thermal. A area. performance of FC-PBGA packages. The substrate. Cp heat capacity. considered was 1.09mm thick and is different from the kind. k thermal…
- Enhanced Imager Chip Packaging for Automotive Applications (.pdf)
provides the optical access to the. imager chip. The use of a transparent underfill material. reduces the rate of moisture infiltration and reduces. optical reflections within the package structure. The flex. may be extended beyond the package to allow surface. mounting of additional passive and active…
- Appliance sensors become hot stuff
flow-rate sensor targets the refrigeration industry to more accurately fill ice-cube trays. There it’s expected to reduce the number of over and underfill service calls. LIQUID-LEVEL SENSOR. The liquid-level sensor (LLS) measures water level in the tub bottom of a clothes washer or sump section…
- Glossary of Forging Terms
, or structures that does not impair the surface or internal integrity of the part. Nonferrous Metals or alloys that contain no appreciable quantity of iron; applied to such metals as aluminum, copper, magnesium, and their alloys. Nonfill (underfill) Forging condition that occurs when the finish die…
Underfill | Products & Suppliers on GlobalSpec
时间:2012年03月05日 11:23:04 | 作者:admin | 分类:Q&A | 浏览:49,867 views
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Underfill
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Encapsulants and potting compounds are resins or adhesives that are used to encapsulate circuit boards and semiconductors, fill containers of electronic components, and infiltrate electrical coils. They provide environmental protection, electrical insulation and other specialized characteristics.
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Featured Products for Underfill Top
Parts by Number for Underfill Top
| Part # | Distributor | Manufacturer | Product Category | Description |
|---|---|---|---|---|
| 1061022 | Straight Road Electronics, Inc. | MISCELLANEOUS | Not Provided | LOCTITE 3536 UNDERFILL |
| 8030 | Allied Electronics, Inc. | AIM SOLDER | Not Provided | Underfill FF35; 30cc; for Capillary Flow for Flip Chip; CSP; BGA and MICRO-BGA |
| 8146 | Allied Electronics, Inc. | AIM SOLDER | Not Provided | ONE-STEP Underfill 688;30 cc;No-Flow Underfill Flip Chip;CSP;BGA;and MICRO-BGA |
| 839286 | Newark / element14 | LOCTITE | Not Provided | LOCTITE – 839286 – 3517 EPOXY UNDERFILL |
| 1061022 | Digi-Key | Loctite | Tapes, Adhesives | 3536 REWORKABLE UNDERFILL |
Conduct Research Top
Engineering Web Search: Underfill Top
| K.R. Anderson, Inc. – Underfill Browsing: Underfill Manufacturers 3M Ablestik See K.R. Anderson, Inc. Profile & Catalog |
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| Correlation of Flip Chip Underfill Process Parameters and… Correlation of Flip Chip Underfill Process Parameters and Material Properties with In-Process Stress Generation |
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| Application Note AN-1050 DirectFET? Technology Materials and… information about the potential impact of four factors in assembly: underfill, lead-free solder, insulated metal substrates and conformal coatings. See International Rectifier Information |
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| SMT Epoxy – BGA Underfill SMT Epoxy – BGA Underfill 623 Underfill Epoxy Underfill Cleaning Chemicals Stencil Cleaning See AIM Products Australia Pty Ltd. Information |
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| Nordson MARCH – Semiconductor Solutions – Underfill | |
| November/December 2008 THe INTerNATIoNAL mAGAZINe For… mAGAZINe For eLecTroNIc PAcKAGING APPLIcATIoNS Jetting PoP Underfill p.14 ? Hydrid Bonding for 3D ICs p.18 ? Reducing TSV Costs p.24 ? Improved Flip See Nordson Corporation Information |
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| Moldflow Corporation – Prodotti – Soluzioni per l’analisi di… MPI / Underfill Encapsulation MPI/Underfill Encapsulation is an optional add-on module that extends the |
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| Injection Molding | Simulation Software – Moldflow MPI/Underfill Encapsulation MPI/Underfill Encapsulation ????????????? MPI/Reactive Molding ???????????????????? |
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| underfill 92% BGA Underfill Rework – 3/29/04 – BGA Underfill Rework Few people underfill PBGA. People underfill CCGA, uBGA, and FC. See SMTnet, Inc. Information |
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| Underfill Underfill Views: 980 Underfill fsw 04/25/08 Underfill Flipit 04/25/08 Underfill Real Chunks See SMTnet, Inc. Information |
