NATASHA B. RACHELL
Physics Teacher
Lithonia High School
GEORGIA TECH MATERIALS SCIENCE AND ENGINEERING
ACKNOWLEDGEMENTS
DR. C.P. WONG
(HEAD OF DEPT.)
DR. XIAO FEI
(MY MENTOR)
SOME DIFFERENT BRANCHES THAT MATERIALS SCIENCE AND ENGINEERING AFFECT:
MICROELECTRONICS:THIS DIVISION WORKS ON MAKING MICROELECTRONIC UNITS ...
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这又是一份namics公司撰写的关于底部填充过程中空洞（气泡）产生的原因及避免的方法的，其中是以其U8439-1型号为例进行分析的。关于空洞(气泡)产生的原因可以总结为两大类，一类是叫Capture void，一类是叫Volatile void。用中文理解就是一类是捕获空洞（气泡）？一类是挥发产生的空洞（气泡）。前面这个Capture void表达可能不够确切，但一时也想不起更好的表达...
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Flip-Chip is an interconnection technique of advanced electronic device. The advantages of Flip-Chip are high I/O counts, short electronic signal path and small size. Most of electronic device of Flip-Chip are packaged by underfill that the encapsulant was driven by capillary force into the space between the chip and substrate. Underf...
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アンダーフィル
アンダーフィルとは、集積回路の封止に用いられる液状硬化性樹脂の総称である。主にエポキシ樹脂を主剤としたコンポジットレジンが主流となる。
目次
[非表示]
1 概要
2 組成
3 備考
4 関連項目
5 外部リンク
概要 [編集]
ワイヤーボンディング、フリップチップボンディング等で基材へ一次実装され...
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STUDY ON THE NANOCOMPOSITE UNDERFILL FOR FLIP-CHIP APPLICATION
A Thesis Presented to The Academic Faculty by Yangyang Sun
In Partial Fulfillment
of the Requirements for the Degree
Doctor of Philosophy in the
School of Chemistry and Biochemistry
Georgia Institute of Technology
December, 2006
TABLE OF CONTENTS
ACKNOWLEDGEM...
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Papers | 浏览:8,047 views
The application of underfill materials to fill up the room between the chip and substrate is known to substantially improve the thermal fatigue life of flip chip solder joints. Nowadays, no-flow underfill materials are gaining much interest over traditional underfill as the application and curing of this type of underfill can be undert...
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童凌杰，王鹏，肖斐
（复旦大学材料科学系，上海200433）
摘要：合成了两种分别含有叔酯键和叔醚键的环氧化合物EP - 1 和EP - 2，其结构通过红外光谱、氢核磁共振谱及环氧当量测定等方法得到证实。EP - 1 与已有商品ERL - 4221 以环氧物质的量比1：1 混合组成EP - 3。EP - 2 和EP - 3 用酸酐类固化剂HMPA 固化。TGA 测试表明它们具有理想的起始热分解温度（ I...
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Underfill Rework Process Qualification
celestica
Objective and Test Vehicles
General Rework Flow and Major Keys
Board input
Experiment # 1
Experiment # 2
Experiment # 3
Proposed Rework Process Flow
Conclusion
下载附件查看全文：[download id="29"]
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Reworkability of Underfill Materials
NEPP Deliverable
Jong Kadesch
Harry Shaw
10/10/01
Outline
• Objective
• Procurement
– underfill material, and two rigid boards (one with pins, and one
without pins)
• Assembly Process
– Mate two rigid boards using conductive epoxy
– Column Grid Array (CGA) interconnection
– Fill...
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BY ALAN LEWIS
ALAN LEWIS, director of dispensing technology
Devices that use underfill have proliferated both in package type and volume. The need for underfilling a wide variety of packages for reliability is well established. The equipment used to dispense underfill materials has matured, but the technological improvements for need...
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