如何搞定Underfill胶水固化填充不足
文章出处： 人气：：21
随着细间距CSP/PoP等集成电路封装越来越广泛地应用于各种电子产品中，此类元件的细小焊点可靠性就越来越受到大家的重视了。在热应力或机械应力作用下，精细的焊点可能出现断裂失效问题。现在业界普遍采用Underill工艺以降低应力对焊点的影响，但Underfill在操作过程中又可能出现一些制程问题...
A well-orchestrated PCB design and assembly plan is required to successfully implement techniques such as underfill in next generation OEM embedded consumer and mobile designs.
Two distinct market sectors in embedded systems are driving a trend to ever smaller components that do more, do it more reliably, and do it while withstandin...
作者:admin | 分类:
Article | 浏览:9,766 views
1. CHEMICAL PRODUCT AND COMPANY IDENTIFICATION
1) PRODUCT NAME : UNIQUE 3075BHF
2) CHEMICAL FAMILY : FORMULATED EPOXY RESIN
3) TYPICAL APPLICATIONS : UNDERFILL
3) MANUFACTURER : - NAME : HI-TECH KOREA CO., LTD. - ADDRESS : # 191-7, SUWORAM-RI, SEOTAN-MYEON, PYONGTAEK-SI, KYEONGGI-DO, KOREA - TELEPHONE NUMBER : +82-31-665-50...
1. PRODUCT DESCRIPTION
UNIQUE 3075BHF is a fast flow, reworkable, single component epoxy glue that is designed to improve the attachment strength of CSP & BGA or Flip Chip devices during mechanical stress testing such as drop and bending testing.
2. KEY FEATURES
* Excellent Chemical Resistance and Water-Proofing * Excellen...
LOCTITE® 190967™is a single component, epoxy adhesive developed as reworkable CSP underfill. It cures rapidly at low temperature on exposure to heat. It is designed to give excellent protection of assembled devices from failure due to physical impact and/or thermal cycling. The low viscosity allows filling in gaps under CSP or BGA. The...
UnderfillTraining Report
Content
Flip Chip Technology
UnderfillProcess
UnderfillMachine
UnderfillEpoxy
UnderfillFailure Mode Analysis
Applied Component and Foreground of Underfill
download files： Underfill知识培训-硬盘行业从业经验
作者:底部填充胶 | 分类:
Papers | 浏览:5,449 views
PRODUCT DESCRIPTION
LOCTITE ECCOBOND UF 3915 provides the following product
characteristics:
Technology Epoxy
Appearance Black liquid
Cure Snap Cure or Heat cure
Product Benefits ● Halogen free
● One component
● Snap curable
● Fast flow
● High Tg
● Easy rework
● High fracture toughness
● Excellent thermal cycle performance...
Abstract
The underfill dispensing process has been studied through material characterization and application of statistical tools. Coefficient
of Planar Penetrance (COPP) introduced by Schwiebert and Leong3 was used to evaluate the flow performance of three types of
underfills. It is dependent on the viscosity, the surface tension, ...
作者:底部填充胶 | 分类:
Papers | 浏览:4,067 views
LOCTITE® 3505™ is a one part, heat curable epoxy. It is designed for use as a reworkable CSP(FBGA) or BGA underfill for protection of solder joint against mechanical stress when used for hand held electronics devices. It cures rapidly on exposure to heat. It is designed to give excellent protection from failure due to mechanical stress...
产品描述：
EP313(原3113)底部填充胶是单组分热固化的环氧胶。可快速固化，具有高粘接性能、低模量和可修复性。耐候性佳，贮存稳定性好。可用于针筒点胶。
典型用途
用于倒装芯片中球栅阵列（BGA）和芯片尺寸封装（CSP）等的封装中。
点击下载：HYSTIC-UNDERFILL-EP313-TDS-CN
