当前位置:首页 > Article,TDS&MSDS

Hysol package level underfill

The proliferation of handheld devices and the trend toward thinner, less rigid PCB's are driving the demand for improved shock resistance and increased electronic device reliability. Hysol® package level underfill encapsulants meet stringent JEDEC level testing requirements and are compatible with the high temperature processing req...

作者:admin | 分类:Article, TDS&MSDS | 浏览:5,603 views

PROCESS-GUIDELINE FOR CSP/BGA UNDERFILLS ON BOARD ASSEMBLY LEVEL

PROCESS-GUIDELINE FOR CSP/BGA UNDERFILLS ON BOARD ASSEMBLY LEVEL   Prepared by: Josef Schneider Tests performed by: Andreas Karch, Antje Dümmig Edition: August 24th, 2001 TABLE OF CONTENTS 1. NECESSITY FOR UNDERFILL 3 2. UNDERFILL DIFFERENTIATION 3 3. UNDERFILL SELECTION 4 4. UNDERFILL MATERIALS FOR ...

作者:admin | 分类:Article | 浏览:9,245 views

底部填充对PoP器件可靠性的影响测试

底部填充对PoP器件可靠性的影响测试 作者:Vicky Wang 汉高乐泰(中国)有限公司,中国山东省烟台市;Dan Maslyk,汉高公司,美国加州尔湾市 尽管针对堆叠封装(PoP)器件的板级可靠性,包括带或不带底部填充的PoP器件以及不同的底部填充方式(即底部完全填充、四角绑定胶和边角补强胶),存在大量与跌落试验和热循环性能有关的研究,但在有关底部填充策...

作者:风间飞猪 | 分类:Article | 浏览:5,720 views

Underfill(底部填充劑)的目的與操作程序

底部填充劑(Underfill)原本是設計給覆晶晶片(Flip Chip)以增強其信賴度用的,因為矽材料做成的覆晶晶片的熱膨脹係數遠比一般基版(PCB)材質低很多,因此在熱循環測試(Thermal cycles)中常常會有相對位移產生,導致機械疲勞而引起焊點脫落或斷裂的問題,後來這項技術被運用到了一些 BGA 晶片以提高其落下/摔落時的可靠度。 底部填充劑的材料通常使用環氧樹脂(Epoxy...

作者:风间飞猪 | 分类:Article | 浏览:10,772 views

METHODS FOR GAINING RELIABILITY IN UNDERFILL APPLICATIONS

Voids or air gaps in underfill are a common problem across underfill applications, from the smallest die on flex to the largest BGA. The consequences of having voids in underfilled parts depend on the package design and use model. Voids typically result in a loss of reliability. This article explores strategies for troubleshooting void...

作者:admin | 分类:Article | 浏览:5,006 views

STAYCHIPTM Capillary Underfill Encapsulants

SCOPE This document is intended to assist package and product assemblers with handling, dispensing, curing and troubleshooting capillary-type underfill encapsulants. An introduction is included to acquaint the reader with the history and nature of these materials. Please contact your Cookson representative for assistance with underf...

作者:admin | 分类:Article | 浏览:5,140 views

Underfill Update: NUF, MUF, WUF, and Other Stuff

Underfill Update: NUF, MUF, WUF, and Other Stuff Dr. Ken Gilleo, Cookson Electronics <kgilleo@ieee.com> Background Many decades ago, the Flip Chip was born of necessity in New York, of all places. IBM was pursuing the optimum process for connecting chips to the outside world. The big mainframe computer makers have always be...

作者:admin | 分类:Article | 浏览:21,350 views

Process Benefits of Underfill Encapsulants for CSPs and BGAs

Underfill encapsulants were originally developed to encapsulate flip chip ICs. A silicon flip chip has a much lower coefficient of thermal expansion (CTE) than the substrate it is assembled on. By Karl Loh and Edward Ibe In thermal cycling, there is relative movement of the flip chip and the board, resulting in mechanical fatigue...

作者:admin | 分类:Article | 浏览:5,771 views

Adhesion and Debonding of Underfill to SiNx passivation

Motivation: The overwhelming trend in the microelectronics industry today is to strive toward smaller feature dimensions on each chip.  With the increased number of devices on one integrated circuit, there is a need for packaging that can accommodate the growing population of interconnects required to attach these devices to the circu...

作者:admin | 分类:Article | 浏览:6,396 views

无铅环境下助焊剂和下填料的兼容问题

作者:Renzhe Zhao, Qing Ji, George Carson, Michael Todd, Gary Shi; electronics group of Henkel 自从20年前引入倒装芯片集成技术之后,在现代器件中采用该技术的优势已经得到了充分的证明。在封装体或电路板上通过设计,将芯片有源面翻转粘结到基板上,可以获得像更短和更有效的互连、更低的电感值、更高的工作频率、更好的杂波控制、更高的密度、更多的I...

作者:admin | 分类:Article | 浏览:4,485 views