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LOCTITE underfill 3549

PRODUCT DESCRIPTION LOCTITE® 3549 is a fast flow, low temperature cure, reworkable epoxy underfill for BGA and CSP devices. It exhibits high adhesion to flexible and rigid circuit substrates. LOCTITE® 3549, when fully cured, provides excellent protection for the solder joints against induced stresses, increasing both drop test and tem...

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住友电木的二次UNDERFILL材料

“SUMIMAC” ECR-9945K is designed for secondary underfill and is suitable for CSP or LGA etc. ECR-9945K is one component epoxy resin with low-temperature fast curing, has a good reworkability and good flowability. ...... 3. Reworking(Removing resin) 3.1. Heat the part until solder melting point. 3.2. Parts are peeled off by twee...

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SUF Secondary Under Fill XSUF1577-24

NAMICS  XSUF1577-24  TDS Repairable  BGA/CSP Reinforcing Encapsulant   dowload pdf file : [download id="21"]

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PACKAGING MATERIALS Hysol® Underfills

Modern hand held devices and the trend toward thinner, less rigid PCBs are driving the demand for improved shock resistance and increased electronic device reliability. Hysol® package level underfill encapsulants meet stringent JEDEC testing requirements and are compatible with the high temperature processing required for lead-free ...

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ZYMET CN1703 UNDERFILL TDS

REWORKABLE CSP and BGA UNDERFILL ENCAPSULANT CN-1703 is a reworkable underfill encapsulant for CSP and BGA encapsulation that cures quickly at low temperature. It is capable of flowing quickly across distances of 750 mils and greater. This encapsulant exhibits excellent adhesion to organic substrates. TYPICAL PROPERTIES Color Cloudy...

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HYSOL UNDEERFILL FP4526 TDS

PRODUCT DESCRIPTION FP4526™ provides the following product characteristics: Technology Epoxy Appearance Blue Product Benefits • Low viscosity • Fast flow • Excellent wettability • Excellent adhesion • Ideal for high reliability Applications • Hi-Pb and Pb-free applications Filler Weight, % 63 Cure Heat cure Application Und...

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Hysol FP4548FC UNDERFILL TDS

PRODUCT DESCRIPTION Hysol® FP4548FC is a high purity, liquid epoxy encapsulant designed as an underfill for flip chip devices. FP4548FC features low coefficient of thermal expansion properties and improved toughness. When fully cured, FP4548FC forms a rigid, low stress seal that dissipates stress on solder joints and extends thermal c...

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HYSOL UNDERFILL UF3801 TDS

PRODUCT DESCRIPTION UF3801 provides the following product characteristics: Technology Epoxy Appearance Black liquid Cure Heat cure Product Benefits • One component • Reworkable • Fast cure at moderate temperatures • Minimal stress on other components • High Tg • Compatible with most Pb-free and halogen-free solders • Stable...

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LOCTITE 3517 UNDERFILL

今天有位朋友向我咨询到乐泰的一款underfill产品,型号是3517,据说是用在sharp的PDA类产品上面,我对3513了解多一些,因为碰到的手机客户用此款的较多,公司的DU901和DU902也都是针对3513同类应用的。于是去官方网站下载了一份看了看!看上去与3513还比较类似,不过固化的温度似乎可以更低一些,时间也稍微长一些,还有就是Tg点似乎要高一些,但返修方式好像是一...

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HYSOL UNDERFILL UF3800 TDS

PRODUCT DESCRIPTION UF3800 provides the following product characteristics: Technology                                                                       Epoxy Appearance                                                                       Black liquid Cure                                                                         ...

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