CSP and Flip Chip Underfill Processes and Tools For Efficient Manufacturing

Review of CSP and Flip Chip Underfill Processes and When To Use the Right Dispensing Tools For Efficient anufacturing By Steven J. Adamson Asymtek, A Nordson Company 2762 Loker Ave. West, Carlsbad, CA 92008 tel: 1-760-930-7274 http://www.asymtek.com Abstract: The need to underfill chip scale package (CSP) and Flip Chip device...

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METHODS FOR GAINING RELIABILITY IN UNDERFILL APPLICATIONS

Voids or air gaps in underfill are a common problem across underfill applications, from the smallest die on flex to the largest BGA. The consequences of having voids in underfilled parts depend on the package design and use model. Voids typically result in a loss of reliability. This article explores strategies for troubleshooting void...

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Application Guidelines for Loctite Underfill Encapsulants

Table of Contents Subject Page Scope 3 Introduction to Underfill Encapsulants 3 Background 3 Underfill Classifications 4 Capillary Underfill 4 Fluxing (No-Flow) Underfill 4 Removable Underfill 4 Nature of Capillary Underfill 5 Designing Packages for Underfill Processability 7 Product Labeling 7 Product Code 7 Lot Number 8 ...

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LOCTITE UNDERFILL PRODUCTS 3536

PRODUCT DESCRIPTION 3536™ provides the following product characteristics: Technology Epoxy Appearance Black Components One component Product Benefits • Reworkable • Cures rapidly at low temperatures • Minimizes thermal stress • Rapid device throughput • Excellent protection for solder joints agains mechanical stress Cure Heat...

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STAYCHIPTM Capillary Underfill Encapsulants

SCOPE This document is intended to assist package and product assemblers with handling, dispensing, curing and troubleshooting capillary-type underfill encapsulants. An introduction is included to acquaint the reader with the history and nature of these materials. Please contact your Cookson representative for assistance with underf...

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Underfill Update: NUF, MUF, WUF, and Other Stuff

Underfill Update: NUF, MUF, WUF, and Other Stuff Dr. Ken Gilleo, Cookson Electronics <kgilleo@ieee.com> Background Many decades ago, the Flip Chip was born of necessity in New York, of all places. IBM was pursuing the optimum process for connecting chips to the outside world. The big mainframe computer makers have always be...

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Process Benefits of Underfill Encapsulants for CSPs and BGAs

Underfill encapsulants were originally developed to encapsulate flip chip ICs. A silicon flip chip has a much lower coefficient of thermal expansion (CTE) than the substrate it is assembled on. By Karl Loh and Edward Ibe In thermal cycling, there is relative movement of the flip chip and the board, resulting in mechanical fatigue...

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Transforming Flip Chip Back Into a CSP with Reworkable Wafer-Level Underfill

Transforming Flip Chip Back Into a CSP with Reworkable Wafer-Level Underfill Ken Gilleo - ET-Trends David Blumel Alpha Metals The Packaging Revolution Flip Chip vs. CSP Why Underfill? Classes of Underfill Final Generation FC; a CSP Conclusions download pdf file: [download id="39"]

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Advances in Fast Underfill of Flip Chips

Advances in Fast Underfill of Flip Chips Alec J. Babiarz and Horatio Quinones Asymtek, 2762 Loker Avenue West, Carlsbad, CA. 760-930-3311 Abstract: One of the barriers to mainstream use of flip chips was the underfill process. The time required for capillary flow out of the underfill was perceived as a process bottleneck in t...

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大小倒装芯片的快速底部填充制程(英文版)

FAST UNDERFILL PROCESSES FOR LARGE TO SMALL FLIP CHIPS ABSTRACT The biggest conceptual impediment to capillary underfill isthe perception that the process is a major bottleneck in the production line. However, in the last few years, great strides have been made in equipment, materials and dispensing processes that have removed un...

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