Review of CSP and Flip Chip Underfill Processes and When To Use the Right Dispensing Tools For Efficient anufacturing
By Steven J. Adamson
Asymtek, A Nordson Company
2762 Loker Ave. West, Carlsbad, CA 92008
tel: 1-760-930-7274
http://www.asymtek.com
Abstract：
The need to underfill chip scale package (CSP) and Flip Chip device...
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Voids or air gaps in underfill are a common problem across underfill applications, from the smallest die on flex to the largest BGA. The consequences of having voids in underfilled parts depend on the package design and use model. Voids typically result in a loss of reliability. This article explores strategies for troubleshooting void...
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Table of Contents
Subject Page
Scope 3
Introduction to Underfill Encapsulants 3
Background 3
Underfill Classifications 4
Capillary Underfill 4
Fluxing (No-Flow) Underfill 4
Removable Underfill 4
Nature of Capillary Underfill 5
Designing Packages for Underfill Processability 7
Product Labeling 7
Product Code 7
Lot Number 8
...
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PRODUCT DESCRIPTION
3536™ provides the following product characteristics:
Technology Epoxy
Appearance Black
Components One component
Product Benefits • Reworkable
• Cures rapidly at low temperatures
• Minimizes thermal stress
• Rapid device throughput
• Excellent protection for solder joints agains mechanical stress
Cure Heat...
SCOPE
This document is intended to assist package and product assemblers with handling, dispensing, curing and troubleshooting capillary-type underfill encapsulants. An introduction is included to acquaint the reader with the history and nature of these materials. Please contact your Cookson representative for assistance with underf...
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Underfill Update: NUF, MUF, WUF, and Other Stuff
Dr. Ken Gilleo, Cookson Electronics
<kgilleo@ieee.com>
Background
Many decades ago, the Flip Chip was born of necessity in New York, of all places. IBM was pursuing the optimum process for connecting chips to the outside world. The big mainframe computer makers have always be...
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Underfill encapsulants were originally developed to encapsulate flip chip ICs. A silicon flip chip has a much lower coefficient of thermal expansion (CTE) than the substrate it is assembled on.
By Karl Loh and Edward Ibe
In thermal cycling, there is relative movement of the flip chip and the board, resulting in mechanical fatigue...
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Transforming Flip Chip Back Into a CSP with Reworkable Wafer-Level Underfill
Ken Gilleo - ET-Trends
David Blumel Alpha Metals
The Packaging Revolution
Flip Chip vs. CSP
Why Underfill?
Classes of Underfill
Final Generation FC; a CSP
Conclusions
download pdf file: [download id="39"]
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Advances in Fast Underfill of Flip Chips
Alec J. Babiarz and Horatio Quinones
Asymtek, 2762 Loker Avenue West, Carlsbad, CA.
760-930-3311
Abstract：
One of the barriers to mainstream use of flip chips was the underfill process. The time required for capillary flow out of the underfill was perceived as a process bottleneck in t...
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FAST UNDERFILL PROCESSES FOR LARGE TO SMALL FLIP CHIPS
ABSTRACT
The biggest conceptual impediment to capillary underfill isthe perception that the process is a major bottleneck in the production line. However, in the last few years, great strides have been made in equipment, materials and dispensing processes that have removed un...
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