The proliferation of handheld devices and the trend toward thinner, less rigid PCB's are driving the demand for improved shock resistance and increased electronic device reliability.
Hysol® package level underfill encapsulants meet stringent JEDEC level testing requirements and are compatible with the high temperature processing req...
PROCESS-GUIDELINE FOR CSP/BGA UNDERFILLS ON BOARD ASSEMBLY LEVEL
Prepared by: Josef Schneider
Tests performed by: Andreas Karch, Antje Dümmig
Edition: August 24th, 2001
TABLE OF CONTENTS
1. NECESSITY FOR UNDERFILL 3
2. UNDERFILL DIFFERENTIATION 3
3. UNDERFILL SELECTION 4
4. UNDERFILL MATERIALS FOR ...
作者:admin | 分类:
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Underfill Overmold ~ Low k chip & Lead Free Bump ~
Underfill ~ CRP-4120series ~
Good adhesion to molding compound
Molding Compound
~ EME-G series ~
Sumitomo Bakelite Co., Ltd.,
download pdf file: [download id="49"]
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前几日在国外的一个通讯论坛GSM-Forum（http://forum.gsmhosting.com/vbb/index.php）上面下载了一份关于underfill返修的技术资料，一直没有时间细看，近日抽空学习了一遍。这是一份motorola公司内部的关于Repair Methods的操作规程，是2007年的版本，此资料图文并茂的阐述了几种不同情况下的返修，包括普通元器件的返修、BGA的返修、POP的返修，其中后两者的返修...
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By Dr. Ken Gilleo & David Blumel
Alpha Metals/Cookson, 250 Culver Ave.
Jersey City, NJ 07304
Abstract
Most Flip Chip assemblies require underfillto bestow reliability that would otherwise be ravished by stress due tothermomechanical mismatch between die and substrate. While underfill can beviewed as “polymer magic” and the ke...
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Reliability concerns in flip chip packaging pivot on the underfill material used, apart from other factors. Hinge your selection of the right underfill on its properties such as CTE, viscosity, flow characteristics, modulus, and adhesion.
By Dr. Ignatius J. Rasiah Material Scientist Johnson Matthey (Singapore)
As IC packages ...
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底部填充对PoP器件可靠性的影响测试
作者：Vicky Wang
汉高乐泰（中国）有限公司,中国山东省烟台市；Dan Maslyk,汉高公司，美国加州尔湾市
尽管针对堆叠封装（PoP）器件的板级可靠性，包括带或不带底部填充的PoP器件以及不同的底部填充方式（即底部完全填充、四角绑定胶和边角补强胶），存在大量与跌落试验和热循环性能有关的研究，但在有关底部填充策...
作者:风间飞猪 | 分类:
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FC- BG A/ CS P底 层填充液体环氧封装材料
陶志强 王德生 李海燕 李洪深 范琳 杨士勇.
中科院化学所工程塑料国家重.x实验室高技术材料研究室， 北京100080)
[摘 要 】FC-BGA/CSP用底层填充料(Underfill) 是一种填充球型硅微粉的低粘度液体环氧封装料，主要用于填充倒装坏芯片(Flip chip, FC)与基板之间的狭缝，增强凸焊点与基板的连接强度，密...
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底部填充劑(Underfill)原本是設計給覆晶晶片(Flip Chip)以增強其信賴度用的，因為矽材料做成的覆晶晶片的熱膨脹係數遠比一般基版(PCB)材質低很多，因此在熱循環測試(Thermal cycles)中常常會有相對位移產生，導致機械疲勞而引起焊點脫落或斷裂的問題，後來這項技術被運用到了一些 BGA 晶片以提高其落下/摔落時的可靠度。
底部填充劑的材料通常使用環氧樹脂(Epoxy...
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Processing and Reliability of CSPs withUnderfill
Jing Liu & R. Wayne Johnson
Laboratory for Electronics Assembly &Packaging– Auburn University
162 Broun Hall, ECEDept.
Auburn, AL 36489 USA
Erin Yaeger, Mark Konarski & Larry Crane
Loctite Corporation
1001 Trout Brook Crossing Rocky Hill, CT06067 USA
Abstract
The...
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